LFE2-35E-6FN484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA

Quantity 815 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35E-6FN484I – ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA

The LFE2-35E-6FN484I is a field programmable gate array (FPGA) from Lattice Semiconductor identified as an ECP2-class device. It provides programmable logic resources with 32,000 logic elements, approximately 0.34 Mbits of embedded memory, and a 331‑pin I/O capacity in a compact 484‑BBGA package.

Marketed for industrial applications, the device combines high I/O density, on‑chip memory, and extended temperature capability to support designs that require robust operation and significant interface and logic capacity.

Key Features

  • Programmable Logic: 32,000 logic elements delivering flexible, reconfigurable logic capacity for custom digital functions and signal processing.
  • Embedded Memory: Approximately 0.34 Mbits of on‑chip RAM (339,968 total RAM bits) to support buffering, state storage, and local data processing without external memory.
  • I/O Capacity: 331 available I/O pins to accommodate multiple parallel interfaces, sensor inputs, and peripheral connections.
  • Package & Mounting: 484‑BBGA package (supplier device package: 484‑FPBGA, 23×23) in a surface‑mount form factor for compact board integration.
  • Power: Low‑voltage core operation with a supply range of 1.14 V to 1.26 V, enabling designs optimized for modern low‑voltage systems.
  • Temperature & Grade: Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in environments requiring extended temperature tolerance.
  • Regulatory Compliance: RoHS compliant to meet standard lead‑free manufacturing and environmental requirements.

Typical Applications

  • Industrial Control & Automation — Use the device’s industrial temperature range and high I/O count for sensor aggregation, control logic, and deterministic interface handling.
  • Communications & Networking — Leverage the large I/O capacity and on‑chip memory for protocol bridging, packet buffering, and multi‑lane interface management.
  • Embedded Systems & Peripherals — Implement custom peripheral logic, protocol converters, and glue functions using the 32,000 logic elements and embedded RAM.

Unique Advantages

  • High Logic Density: 32,000 logic elements allow implementation of complex custom logic and multiple concurrent functions on a single device, reducing BOM count.
  • Significant On‑Chip Memory: Approximately 0.34 Mbits of embedded RAM supports local buffering and state machines without immediate need for external memory.
  • Extensive I/O Resources: 331 I/O pins provide flexibility for multi‑interface designs, enabling direct connections to numerous sensors, peripherals, and buses.
  • Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to meet the needs of systems exposed to a wide range of environmental conditions.
  • Compact Surface‑Mount Package: 484‑BBGA (484‑FPBGA, 23×23) balances high pin count with a compact footprint for space‑constrained PCBs.
  • Low‑Voltage Core: Core supply range of 1.14 V to 1.26 V supports integration into modern low‑power power rails.

Why Choose LFE2-35E-6FN484I?

The LFE2-35E-6FN484I offers a blend of programmable logic capacity, embedded memory, and high I/O density in an industrial‑rated package from Lattice Semiconductor. It is well suited for engineers designing industrial and embedded systems that require flexible, reconfigurable logic with robust temperature tolerance and compact board integration.

Choosing this FPGA can simplify system design by consolidating multiple functions into a single device, reducing component count while providing the interface and memory resources needed for complex control, communication, and peripheral tasks.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2-35E-6FN484I. Our sales team can provide lead‑time and purchasing options to support your design and production needs.

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