LFE2-35E-6F672C

The LFE2-35E-6F672C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for commercial-grade embedded logic applications. It provides a balance of logic capacity, on-chip memory and high pin‑count I/O in a 672-ball BGA package for space‑constrained board designs.

With 32,000 logic elements, approximately 0.34 Mbits of embedded RAM and up to 450 I/O, this device targets designs that require significant programmable logic, moderate embedded memory, and extensive external connectivity while operating from a low core supply voltage.

Key Features

• Logic Capacity – 32,000 logic elements to implement a wide range of combinational and sequential logic functions.
• Embedded Memory – Approximately 0.34 Mbits of on‑chip RAM available for data buffering, FIFOs and small lookup tables.
• High I/O Count – Up to 450 I/O pins to support dense system interfaces and multiple external peripherals.
• Power and Voltage – Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system architectures.
• Package – 672-ball BGA packaging (supplier package: 672-FPBGA, 27×27 mm) optimized for space-efficient surface-mount assemblies.
• Mounting and Grade – Surface mount device with commercial grade operation for standard temperature environments.
• Operating Temperature – Rated for operation from 0 °C to 85 °C, suitable for commercial temperature environments.
• RoHS Compliant – Meets RoHS requirements for lead‑free assembly and regulatory preferences.

Typical Applications

• High‑I/O Control Systems – Designs requiring large numbers of external interfaces can exploit the device's up to 450 I/O pins for flexible connectivity.
• Logic‑Intensive Embedded Designs – Projects needing around 32,000 logic elements for custom control, state machines or glue logic benefit from the available logic capacity.
• On‑Chip Memory Usage – Applications that require localized buffering or small data stores can use the device’s approximately 0.34 Mbits of embedded RAM.

Unique Advantages

• High Logic Density: 32,000 logic elements provide substantial programmable resources for complex design partitioning without immediate need for external logic chips.
• Generous I/O Availability: Up to 450 I/O pins reduce the need for external I/O expanders and simplify board-level interface routing.
• Compact BGA Packaging: The 672-ball FPBGA (27×27 mm) package enables high pin-count implementations in a compact surface-mount footprint.
• Low Core Voltage: The 1.14 V to 1.26 V supply range supports integration into low-voltage system domains and can help lower overall power consumption at the core.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial product deployment environments.
• RoHS Compliance: RoHS status supports lead‑free manufacturing and environmental compliance goals.

Why Choose LFE2-35E-6F672C?

The LFE2-35E-6F672C delivers a combination of substantial logic resources, embedded memory and very high I/O count in a compact BGA package, making it well suited for commercial embedded systems that require flexible programmable logic and extensive external connectivity. Its low core voltage and RoHS compliance align with contemporary system power and manufacturing requirements.

This FPGA is a practical choice for engineers and procurement teams designing mid‑to‑high complexity boards that need scalable logic capacity, on‑chip RAM for local buffering, and a high pin count for interfacing with multiple peripherals or subsystems.

Request a quote or submit an inquiry to check availability and pricing for the LFE2-35E-6F672C and to discuss how it fits your next FPGA-based design.