LFE2-35E-5FN672I

The LFE2-35E-5FN672I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a mid-range combination of logic density, embedded memory, and high I/O count in a compact ball-grid array package for surface-mount assembly.

Designed for industrial environments, this device targets applications that require substantial I/O capacity, on-chip RAM, and a low-voltage core supply while operating across a wide temperature range.

Key Features

• Logic Capacity — 32,000 logic elements provide substantial programmable logic resources for mid-range designs.
• Embedded Memory — Approximately 0.34 Mbits of on-chip RAM (339,968 total RAM bits) to support buffering, FIFOs, and local data storage.
• High I/O Count — 450 I/O pins to support complex interfacing and multi-channel connectivity.
• Low-Voltage Core — Operates from a 1.14 V to 1.26 V supply, suitable for low-voltage system architectures.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C, meeting common industrial environmental requirements.
• Package & Mounting — 672-ball BGA package (supplier device package: 672-FPBGA, 27×27) with surface-mount mounting for compact board designs.
• RoHS Compliant — Meets RoHS requirements for restricted substances.

Typical Applications

• Industrial Control — Use the FPGA’s industrial temperature range and extensive I/O to implement motor control, sensor aggregation, and real-time control logic.
• Data Acquisition — Leverage 450 I/Os and on-chip RAM for multi-channel data collection, buffering, and preprocessing at the edge.
• Communication Interfaces — Implement protocol bridging and parallel I/O subsystems that require high pin counts and flexible logic.
• Embedded System Glue Logic — Replace discrete logic and CPLDs with a single programmable device to consolidate interfaces and custom logic functions.

Unique Advantages

• High I/O Density: 450 I/Os enable complex interfacing and multi-channel designs without external I/O expanders.
• Substantial Logic Resources: 32,000 logic elements support sizeable mid-range FPGA designs and feature integration.
• On-Chip Memory: Approximately 0.34 Mbits of embedded RAM reduce dependence on external memory for buffering and streaming tasks.
• Industrial Reliability: Specified -40 °C to 100 °C operation supports deployment in industrial and harsh-temperature environments.
• Compact Package: 672-ball BGA (27×27) packaging delivers a high-density solution for space-constrained PCBs.
• Low-Voltage Operation: 1.14 V to 1.26 V core supply aligns with modern low-voltage system designs to minimize power domains.

Why Choose LFE2-35E-5FN672I?

The LFE2-35E-5FN672I combines a robust set of programmable logic resources, nearly 0.34 Mbits of embedded RAM, and an exceptional I/O complement in a compact BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for long-lived, fielded systems that require reliable operation across varying conditions.

This FPGA suits designers and procurement teams aiming to consolidate logic functions, implement high-channel-count interfaces, or add on-device buffering while keeping board footprint and power domains optimized. Backed by Lattice Semiconductor’s ECP2 family, it provides a balanced option for mid-range embedded and industrial designs.

Request a quote or submit an inquiry to purchase the LFE2-35E-5FN672I and discuss availability and lead times with our team.