LFE2-35E-5FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA |
|---|---|
| Quantity | 1,795 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 331 | Voltage | 1.14 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35E-5FN484C – ECP2 Field Programmable Gate Array, 32 000 logic elements
The LFE2-35E-5FN484C is an ECP2 family field programmable gate array (FPGA) IC offering 32 000 logic elements in a compact 484-FPBGA (23×23) surface-mount package. It provides a balance of logic density, on-chip memory, and I/O count for commercial-grade electronic designs.
Key device attributes include approximately 339,968 bits of embedded RAM, 331 user I/Os, a nominal supply voltage of 1.14 V, and an operating temperature range of 0 °C to 85 °C, delivered in tray packaging for board-level assembly.
Key Features
- Core Capacity — 32 000 logic elements enabling substantial logic integration for mid-range FPGA designs.
- Logic Array — Approximately 4,000 CLBs (configurable logic blocks) to structure logic implementation across the device.
- Embedded Memory — Approximately 0.34 Mbits (339,968 bits) of on-chip RAM for buffering, FIFOs, and small memory structures.
- I/O Count — 331 available I/Os to support broad peripheral interfacing and board-level connectivity.
- Power — Single supply condition listed at 1.14 V for core operation.
- Package & Mounting — 484-FPBGA (23×23) supplied in tray format and intended for surface-mount assembly.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
Unique Advantages
- High logic density: 32 000 logic elements allow integration of multiple functions into a single FPGA, reducing external components.
- Substantial on-chip memory: Approximately 0.34 Mbits of embedded RAM supports buffering and local data storage without external memory.
- Extensive I/O: 331 I/Os provide flexibility for interfacing with sensors, peripherals, and board-level buses.
- Compact, surface-mount package: 484-FPBGA (23×23) enables a space-efficient footprint for PCB designs.
- Commercial-grade operating range: 0 °C to 85 °C suits a wide range of standard electronic products and prototypes.
- Single-supply core: Documented nominal supply at 1.14 V simplifies power rail planning for the FPGA core.
Why Choose LFE2-35E-5FN484C?
The LFE2-35E-5FN484C positions itself as a mid-range ECP2 FPGA solution that combines substantial logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its specifications make it suitable for commercial electronic designs that require integration of complex logic functions while managing PCB space and component count.
Engineers and procurement teams seeking a commercially graded FPGA with clear core voltage, temperature range, and assembly-ready packaging will find this part straightforward to evaluate and integrate into designs that benefit from significant embedded logic and memory resources.
Request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering information for LFE2-35E-5FN484C.
