LFE2-35E-5F484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA |
|---|---|
| Quantity | 1,558 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35E-5F484I – ECP2 Field Programmable Gate Array (FPGA) IC, 484‑BBGA
The LFE2-35E-5F484I is an ECP2-series Field Programmable Gate Array (FPGA) in a compact 484‑BBGA package intended for industrial applications. It provides mid-density programmable logic with a combination of logic elements, embedded memory, and a high I/O count suitable for systems that require flexible, on‑board logic integration.
Key attributes include 32,000 logic elements, approximately 0.34 Mbits of embedded RAM, up to 331 user I/O, low-voltage operation (1.14 V–1.26 V), and an industrial temperature range of -40 °C to 100 °C.
Key Features
- Logic Capacity: 32,000 logic elements to implement mid-density custom logic, protocol handling, and control functions.
- Embedded Memory: Approximately 0.34 Mbits of on‑chip RAM for data buffering, state storage, and small lookup tables.
- I/O Density: Up to 331 user I/O pins to support multiple parallel interfaces, sensor and actuator connections, or bus-level interfacing.
- Power Domain: Low-voltage core operation with a supply range of 1.14 V to 1.26 V for integration into low-power system architectures.
- Package & Mounting: 484‑BBGA package (supplier device package: 484‑FPBGA, 23×23) configured for surface-mount assembly in space-constrained boards.
- Industrial Temperature Rating: Specified operation from -40 °C to 100 °C for deployment in industrial environments.
- RoHS Compliance: Environmentally compliant, meeting RoHS requirements.
Typical Applications
- Industrial Control: Implement custom control logic, timing, and interfacing for factory automation and process control equipment using the device's logic capacity and wide operating temperature range.
- I/O Aggregation and Protocol Bridging: Consolidate multiple sensor and peripheral interfaces with the high I/O count and on‑chip RAM for buffering and protocol handling.
- Communications and Networking Modules: Use the programmable logic and I/O resources to implement data framing, interface adaptation, and mid‑rate packet handling functions.
Unique Advantages
- Balanced Mid‑Density Logic: 32,000 logic elements provide a practical trade-off between capability and system cost for mid-range programmable designs.
- Compact, High‑Pin Package: 484‑BBGA (484‑FPBGA, 23×23) offers a small PCB footprint while providing a large number of I/O for complex board-level integration.
- Industrial‑Grade Operation: Rated from -40 °C to 100 °C to meet environmental demands common in industrial deployments.
- Low-Voltage Core: 1.14 V–1.26 V core supply supports integration into modern low-power system architectures.
- On‑Chip Memory for System Tasks: Approximately 0.34 Mbits of embedded RAM supports buffering, FIFOs, and small data structures without an external memory component.
- RoHS Compliant: Supports regulatory requirements for environmentally conscious product designs.
Why Choose LFE2-35E-5F484I?
The LFE2-35E-5F484I is positioned for engineers seeking a mid-density FPGA solution that combines substantial logic capacity, embedded memory, and a high I/O count in a compact, industrial-rated package. Its low-voltage core and surface-mount 484‑BBGA footprint make it suitable for space-constrained assemblies where power and thermal envelopes must be managed.
This device is appropriate for designers building industrial control systems, communications modules, or I/O‑intensive applications that require programmable logic with predictable thermal and environmental characteristics.
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