LFE2-35E-5F484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA

Quantity 1,558 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35E-5F484I – ECP2 Field Programmable Gate Array (FPGA) IC, 484‑BBGA

The LFE2-35E-5F484I is an ECP2-series Field Programmable Gate Array (FPGA) in a compact 484‑BBGA package intended for industrial applications. It provides mid-density programmable logic with a combination of logic elements, embedded memory, and a high I/O count suitable for systems that require flexible, on‑board logic integration.

Key attributes include 32,000 logic elements, approximately 0.34 Mbits of embedded RAM, up to 331 user I/O, low-voltage operation (1.14 V–1.26 V), and an industrial temperature range of -40 °C to 100 °C.

Key Features

  • Logic Capacity: 32,000 logic elements to implement mid-density custom logic, protocol handling, and control functions.
  • Embedded Memory: Approximately 0.34 Mbits of on‑chip RAM for data buffering, state storage, and small lookup tables.
  • I/O Density: Up to 331 user I/O pins to support multiple parallel interfaces, sensor and actuator connections, or bus-level interfacing.
  • Power Domain: Low-voltage core operation with a supply range of 1.14 V to 1.26 V for integration into low-power system architectures.
  • Package & Mounting: 484‑BBGA package (supplier device package: 484‑FPBGA, 23×23) configured for surface-mount assembly in space-constrained boards.
  • Industrial Temperature Rating: Specified operation from -40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliance: Environmentally compliant, meeting RoHS requirements.

Typical Applications

  • Industrial Control: Implement custom control logic, timing, and interfacing for factory automation and process control equipment using the device's logic capacity and wide operating temperature range.
  • I/O Aggregation and Protocol Bridging: Consolidate multiple sensor and peripheral interfaces with the high I/O count and on‑chip RAM for buffering and protocol handling.
  • Communications and Networking Modules: Use the programmable logic and I/O resources to implement data framing, interface adaptation, and mid‑rate packet handling functions.

Unique Advantages

  • Balanced Mid‑Density Logic: 32,000 logic elements provide a practical trade-off between capability and system cost for mid-range programmable designs.
  • Compact, High‑Pin Package: 484‑BBGA (484‑FPBGA, 23×23) offers a small PCB footprint while providing a large number of I/O for complex board-level integration.
  • Industrial‑Grade Operation: Rated from -40 °C to 100 °C to meet environmental demands common in industrial deployments.
  • Low-Voltage Core: 1.14 V–1.26 V core supply supports integration into modern low-power system architectures.
  • On‑Chip Memory for System Tasks: Approximately 0.34 Mbits of embedded RAM supports buffering, FIFOs, and small data structures without an external memory component.
  • RoHS Compliant: Supports regulatory requirements for environmentally conscious product designs.

Why Choose LFE2-35E-5F484I?

The LFE2-35E-5F484I is positioned for engineers seeking a mid-density FPGA solution that combines substantial logic capacity, embedded memory, and a high I/O count in a compact, industrial-rated package. Its low-voltage core and surface-mount 484‑BBGA footprint make it suitable for space-constrained assemblies where power and thermal envelopes must be managed.

This device is appropriate for designers building industrial control systems, communications modules, or I/O‑intensive applications that require programmable logic with predictable thermal and environmental characteristics.

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