LFE2-35E-6F672I

The LFE2-35E-6F672I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial-grade embedded logic applications. It combines a significant logic capacity with on-chip embedded memory and a high I/O count to support dense, I/O‑intensive designs in a compact ball-grid array package.

This device is specified for surface-mount assembly and supports operation across an industrial temperature range, making it suitable for systems that require reliable performance from –40 °C to 100 °C while operating from a low-voltage supply rail.

Key Features

• Logic Capacity  32,000 logic elements provide a balance of programmable logic resources for mid-range FPGA designs.
• Embedded Memory  Approximately 0.34 Mbits of on-chip RAM (339,968 total bits) for buffering, state storage, and small data structures.
• High I/O Count  Up to 450 I/O pins to support dense peripheral connectivity and complex interfacing requirements.
• Power Supply  Operates from a low-voltage supply range of 1.14 V to 1.26 V to align with modern low-voltage system designs.
• Package & Mounting  672-ball FBGA (672-FPBGA, 27×27) in a 672-BBGA case; designed for surface-mount PCB assembly.
• Industrial Temperature Range  Specified for operation from –40 °C to 100 °C to meet industrial environmental requirements.
• Compliance  RoHS-compliant material status for regulatory and manufacturing considerations.

Typical Applications

• Industrial Control and Automation  Use the industrial temperature rating and logic density for control, sequencing, and I/O aggregation in factory and process automation equipment.
• I/O-Intensive Systems  Leverage up to 450 I/O pins for boards that require large numbers of sensor, actuator, or communication interfaces.
• Embedded Logic and Data Handling  Employ the on-chip RAM and logic elements for protocol bridging, data buffering, and custom processing functions.
• Compact, High‑Density Board Designs  The 672-ball FBGA package and surface-mount mounting enable compact PCB layouts where board area and routing density matter.

Unique Advantages

• Balanced Logic and Memory:  32,000 logic elements together with approximately 0.34 Mbits of embedded memory provide a practical mix for mid-range FPGA projects without external memory.
• Extensive I/O Capacity:  Up to 450 I/O pins simplify integration of multiple peripherals and interfaces on a single device, reducing system complexity.
• Low‑Voltage Operation:  The 1.14 V to 1.26 V supply range supports low-voltage system architectures and can help minimize power draw at the device level.
• Industrial Reliability:  Specified operation from –40 °C to 100 °C aligns the device with demanding environmental requirements typical of industrial deployments.
• Compact Packaging:  The 672-FPBGA (27×27) package supports high-density board designs while enabling surface-mount manufacturing workflows.
• Regulatory Readiness:  RoHS compliance assists in meeting environmental and manufacturing standards.

Why Choose LFE2-35E-6F672I?

The LFE2-35E-6F672I delivers a practical combination of logic density, embedded memory, and extensive I/O in a compact 672-ball FBGA package. Its industrial temperature rating and low-voltage operation make it well suited for engineers designing robust embedded systems that require reliable performance across a wide temperature range and substantial peripheral connectivity.

This FPGA is targeted at designs that need a mid-range programmable logic solution with built-in memory and high I/O capacity, offering a clear path for integrating custom logic, data handling, and interface aggregation on a single device.

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