LFE2-35E-6FN672C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA |
|---|---|
| Quantity | 213 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 450 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35E-6FN672C – ECP2 Field Programmable Gate Array (FPGA), 32,000 Logic Elements, 672‑BBGA
The LFE2-35E-6FN672C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications that require sizable programmable logic and abundant I/O. The device provides a balance of logic capacity, embedded memory, and a high I/O count in a 672‑ball BGA package for surface-mount assembly.
With 32,000 logic elements, approximately 0.34 Mbits of embedded memory, and up to 450 user I/O, this part is targeted at systems that need moderate logic density and extensive connectivity while operating from a 1.14 V to 1.26 V supply and within commercial temperature ranges.
Key Features
- Core Logic 32,000 logic elements provide the programmable fabric capacity for implementing custom digital logic and glue functions.
- Embedded Memory Approximately 0.34 Mbits of on-chip RAM (339,968 bits) for data buffering, FIFOs, and small on-chip storage.
- High I/O Count Up to 450 user I/O pins enable extensive peripheral connectivity and interface consolidation on a single device.
- Package & Mounting 672‑BBGA supplier package (672‑FPBGA, 27 × 27 mm) in a surface-mount form factor suited to compact, board-level integration.
- Power Nominal core supply voltage range of 1.14 V to 1.26 V, compatible with low‑voltage FPGA power domains.
- Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operation.
- Regulatory RoHS compliant.
Typical Applications
- Communications and Protocol Bridging Use the 450 I/O and 32,000 logic elements to implement protocol translation, custom packet handling, or interface aggregation in commercial communications equipment.
- High‑I/O Embedded Systems Consolidate multiple peripheral interfaces and I/O functions onto a single FPGA for commercial embedded products requiring dense connectivity.
- Data Acquisition and Conditioning Implement front-end data buffering and preprocessing using the embedded RAM and abundant I/O for commercial test and measurement systems.
- Consumer and Industrial‑class Control Integrate control logic and custom interfaces for commercial devices operating within the specified 0 °C to 85 °C range.
Unique Advantages
- Substantial Logic Capacity: 32,000 logic elements enable implementation of complex finite-state machines, data paths, and glue logic without external ASICs.
- Extensive I/O Integration: 450 I/O pins reduce the need for extra interface chips and simplify board-level routing for multi-signal designs.
- On‑Chip Memory: Approximately 0.34 Mbits of embedded RAM supports buffering and temporary data storage directly within the FPGA fabric.
- Space‑Efficient Packaging: The 672‑BBGA (27 × 27 mm) surface-mount package offers a high-pin-count solution for compact PCB layouts.
- Commercial‑Grade Availability: Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance for broad market use.
Why Choose LFE2-35E-6FN672C?
The LFE2-35E-6FN672C positions itself as a balanced FPGA solution for commercial designs that require moderate logic density combined with a very high I/O count and on-chip memory. Its combination of 32,000 logic elements, approximately 0.34 Mbits of embedded RAM, and up to 450 I/O makes it suitable for consolidating interfaces and implementing custom logic while maintaining a compact BGA footprint.
This device is well suited to design teams building commercial communications equipment, high‑I/O embedded systems, and data acquisition or control products that benefit from integrated logic, memory, and extensive connectivity, backed by Lattice Semiconductor Corporation product availability and RoHS compliance.
If you would like pricing, availability, or a custom quote for the LFE2-35E-6FN672C, request a quote or submit an inquiry and our team will respond with details.