LFE2-35SE-5FN672C

The LFE2-35SE-5FN672C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor's ECP2 family. It delivers a balanced combination of logic capacity, embedded memory and a high I/O count in a compact ball-grid array package.

With 32,000 logic elements, approximately 0.34 Mbits of on-chip RAM and 450 user I/Os, this surface-mount FPGA is intended for commercial electronic designs that require medium-density programmable logic, extensive I/O connectivity and low-voltage operation.

Key Features

• Core Logic Capacity 32,000 logic elements provide the programmable resources needed for medium-density digital functions.
• Embedded Memory Approximately 0.34 Mbits (339,968 bits) of on-chip RAM to support buffering, state machines and local storage.
• I/O Resources 450 user I/Os to enable high pin-count interfacing for dense signal routing and parallel connectivity.
• Power Operating supply range from 1.14 V to 1.26 V for low-voltage system integration.
• Package & Mounting 672-ball BGA package (supplier device package: 672-FPBGA, 27×27) in a surface-mount form factor for compact PCB designs.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for lead-free assembly and environmental compliance.

Typical Applications

• Custom digital logic and prototyping Implements custom state machines, glue logic and prototype designs that require substantial programmable resources.
• High-density I/O interfacing Serves as a hub for designs needing extensive parallel or serial I/O connections, leveraging the 450 available I/Os.
• Embedded control and buffering Uses on-chip RAM (approximately 0.34 Mbits) for local buffering and control functions within commercial electronic products.
• Compact, surface-mount designs Fits applications that require a high-pin-count FPGA in a compact 672-ball BGA package for space-constrained PCBs.

Unique Advantages

• High logic density: 32,000 logic elements give designers ample programmable resources without moving to larger device classes.
• Large I/O footprint: 450 user I/Os reduce the need for external I/O expanders and simplify board-level interfaces.
• On-chip memory: Approximately 0.34 Mbits of embedded RAM supports local storage and data buffering, cutting dependency on external memory for many functions.
• Compact, high-pin-count package: The 672-BBGA (672-FPBGA, 27×27) delivers high connectivity in a surface-mount form factor for dense PCB layouts.
• Low-voltage operation: 1.14–1.26 V supply range enables integration into modern low-voltage systems.
• Commercial readiness: RoHS compliance and a 0 °C to 85 °C operating range align with mainstream commercial product requirements.

Why Choose LFE2-35SE-5FN672C?

The LFE2-35SE-5FN672C provides a practical balance of logic capacity, embedded memory and expansive I/O in a compact BGA package, making it well suited for engineers and OEMs developing commercial electronic products that require medium-density programmable logic. Its low-voltage operation, surface-mount 672-ball package and RoHS compliance support modern board-level integration and assembly flows.

As a member of the ECP2 family from Lattice Semiconductor, this device is positioned for designs that benefit from significant I/O resources and on-chip memory while maintaining a moderate logic footprint and commercial temperature grading.

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