LFE2-35SE-6F484C

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA

Quantity 1,051 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35SE-6F484C – ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA

The LFE2-35SE-6F484C is an ECP2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation provided in a 484-BBGA surface-mount package. It integrates 32,000 logic elements, approximately 0.34 Mbits of embedded memory, and a high I/O count to address moderate-density programmable-logic requirements.

Engineered for commercial-grade embedded designs, this device combines significant on-chip memory and extensive I/O in a compact 484-ball BGA (23×23) footprint, operating from a 1.14 V to 1.26 V core supply and across a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic  32,000 logic elements for implementing moderate-complexity digital logic and state machines.
  • Embedded Memory  Approximately 0.34 Mbits (339,968 bits) of on-chip RAM to reduce external memory requirements and simplify board design.
  • I/O Capacity  331 general-purpose I/Os to support dense system interfacing and flexible pin assignments.
  • Power  Core supply range of 1.14 V to 1.26 V for low-voltage operation.
  • Package & Mounting  484-BBGA (supplier package: 484-FPBGA, 23×23); surface-mount package suited for compact PCB layouts.
  • Operating Range & Compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.

Unique Advantages

  • High logic density: 32,000 logic elements enable implementation of substantial logic functions without external programmable devices.
  • Significant on-chip memory: Approximately 0.34 Mbits of embedded RAM helps reduce BOM and board complexity by minimizing external memory needs.
  • Large I/O complement: 331 I/Os simplify system integration and routing for multi-interface designs.
  • Compact BGA footprint: 484-BBGA (23×23) surface-mount package conserves PCB area while supporting high pin counts.
  • Low-voltage operation: 1.14–1.26 V core supply supports modern low-voltage design considerations.
  • Regulatory readiness: RoHS compliance supports lead‑free assembly and environmental requirements.

Why Choose LFE2-35SE-6F484C?

The LFE2-35SE-6F484C offers a balanced combination of logic capacity, embedded memory, and I/O density in a compact commercial-grade package. It is well suited to designs that require substantial on-chip resources and wide system connectivity while maintaining a small PCB footprint and low-voltage core operation.

This device is appropriate for teams and projects that prioritize integration, reduced external BOM, and straightforward thermal and power planning within a commercial temperature envelope.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the LFE2-35SE-6F484C.

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