LFE2-35SE-6FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA |
|---|---|
| Quantity | 630 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-6FN484C – ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA
The LFE2-35SE-6FN484C is an FPGA IC from Lattice Semiconductor Corporation's ECP2 family, offering mid-range programmable logic capacity and a high I/O count in a compact BGA package. It provides designers with reconfigurable logic resources, embedded memory, and extensive I/O for applications requiring flexible digital implementation.
Key device attributes include 32,000 logic elements, approximately 0.34 Mbits of embedded memory, 331 I/Os, a 484-ball FPBGA package (23 × 23 mm), low-voltage operation (1.14–1.26 V), and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and designed for surface-mount assembly.
Key Features
- Logic Capacity Provides 32,000 logic elements to implement custom digital functions and control logic within a single FPGA device.
- Embedded Memory Includes approximately 339,968 bits of on-chip RAM (≈0.34 Mbits) for buffering, FIFOs, and small data storage requirements.
- I/O Density Offers 331 I/Os to support complex interfacing, parallel buses, and multi-channel connectivity without external multiplexing.
- Power and Voltage Operates from a low-voltage supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
- Package and Mounting Supplied in a 484-FPBGA (23 × 23 mm) package — listed as 484-BBGA — and intended for surface-mount PCB assembly.
- Operating Range Commercial grade operation from 0 °C to 85 °C suitable for standard commercial and embedded environments.
- Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Programmable logic implementations Use the device where reconfigurable digital logic is required, leveraging 32,000 logic elements for custom datapaths and control functions.
- I/O-heavy interfaces Deploy in designs that need many parallel or multi-protocol connections, taking advantage of the 331 available I/Os.
- Embedded buffering and small-data storage Utilize the approximately 0.34 Mbits of on-chip RAM for local buffering, FIFOs, or state storage without external memory.
Unique Advantages
- High logic density: 32,000 logic elements enable substantial on-chip logic implementation while maintaining a single-chip solution.
- Significant embedded memory: Approximately 0.34 Mbits of RAM reduces reliance on external memory for short-term storage and buffering.
- Extensive I/O count: 331 I/Os support complex interfacing and reduce the need for additional I/O expanders.
- Compact, manufacturable package: 484-FPBGA (23 × 23 mm) in a surface-mount format simplifies PCB layout for dense system designs.
- Low-voltage operation: Narrow supply range (1.14–1.26 V) aligns with modern low-voltage digital systems to simplify power supply design.
- RoHS compliant: Meets common environmental standards for electronics manufacturing and assembly.
Why Choose LFE2-35SE-6FN484C?
The LFE2-35SE-6FN484C positions itself as a mid-range FPGA solution that balances logic capacity, embedded memory, and high I/O density in a compact surface-mount FPBGA package. Its specifications make it suitable for designers who need programmable logic resources with substantial interfacing and local memory while operating on low-voltage rails within commercial temperature limits.
Backed by Lattice Semiconductor Corporation and provided in a RoHS-compliant package, this device is appropriate for a range of commercial embedded designs where reconfigurable logic, I/O flexibility, and on-chip memory are primary requirements.
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