LFE2-35SE-6FN672I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA |
|---|---|
| Quantity | 1,250 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 450 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-6FN672I – ECP2 Field Programmable Gate Array (FPGA), 672-BBGA
The LFE2-35SE-6FN672I is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides approximately 32,000 logic elements, roughly 0.34 Mbits of embedded memory, and up to 450 I/O in a compact 672-BBGA package.
Engineered for industrial use, the device supports surface-mount assembly, operates from a 1.14 V to 1.26 V supply range, and is rated for −40 °C to 100 °C. It is RoHS compliant for environmental compliance in assembly processes.
Key Features
- Core / Logic: Approximately 32,000 logic elements to implement complex combinational and sequential logic functions on-chip.
- Embedded Memory: Approximately 0.34 Mbits of on-chip RAM for buffering, state storage, and small data tables.
- I/O Capacity: 450 I/O pins providing extensive connectivity for peripherals, sensors, and high-density interfaces.
- Power: Supports a core voltage supply range of 1.14 V to 1.26 V to match low-voltage system designs.
- Package & Mounting: 672-BBGA package (supplier device package: 672-FPBGA, 27×27) in a surface-mount form factor for high-pin-count, space-efficient board designs.
- Temperature & Grade: Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in challenging environments.
- Environmental Compliance: RoHS compliant for lead-free manufacturing and regulatory alignment.
Unique Advantages
- High logic density: Approximately 32,000 logic elements enable on-chip implementation of substantial digital functions, minimizing reliance on external logic.
- Significant on-chip memory: Around 0.34 Mbits of embedded RAM supports local buffering and state retention for streamlined data handling.
- Extensive connectivity: 450 I/O pins provide flexibility for interfacing with multiple high-density peripherals and external devices.
- Industrial operating range: Rated for −40 °C to 100 °C to support temperature-sensitive deployments.
- Compact high-pin-count package: The 672-BBGA (672-FPBGA, 27×27) balances dense I/O capability with a board-friendly footprint.
- Low-voltage operation: 1.14–1.26 V supply requirement aligns with modern low-voltage FPGA implementations.
Why Choose LFE2-35SE-6FN672I?
The LFE2-35SE-6FN672I positions itself as a practical choice for designs that require a balanced combination of logic capacity, embedded memory, and high I/O density within an industrial-temperature FPGA. Its 672-BBGA surface-mount package and RoHS compliance make it suitable for space-conscious, environmentally compliant production builds.
Designed and manufactured by Lattice Semiconductor Corporation, this device is suited to engineering teams seeking a robust, mid-density FPGA solution that supports low-voltage operation and sustained performance across a wide temperature range.
Request a quote or submit a product inquiry to evaluate LFE2-35SE-6FN672I for your next design.

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