LFE2-35SE-7F672C

IC FPGA 450 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA

Quantity 955 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O450Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35SE-7F672C – ECP2 Field Programmable Gate Array (FPGA) 672-BBGA

The LFE2-35SE-7F672C is a commercial-grade ECP2 family Field Programmable Gate Array (FPGA) delivered in a 672-ball BGA package. It combines a high logic capacity and on-chip memory with a large I/O count to support complex, high-density digital designs that require a compact package and RoHS compliance.

Key Features

  • Logic Capacity  Approximately 32,000 logic elements providing substantial programmable fabric for implementing custom digital logic and complex control functions. The device data also lists 4,000 LABs/CLBs.
  • Embedded Memory  Approximately 0.34 Mbits of on-chip RAM (339,968 total RAM bits) for buffering, state storage, and small data sets within the fabric.
  • I/O Density  Up to 450 user I/Os to support wide parallel interfaces, multiple buses, and mixed-signal front-end connectivity in a single device.
  • Power  Core supply range of 1.14 V to 1.26 V to match system power architectures that utilize low-voltage FPGA cores.
  • Package & Mounting  672-BBGA package (supplier device package: 672-FPBGA, 27 × 27 mm) designed for surface-mount PCB assembly to save board space while providing high pin count.
  • Operating Range  Commercial operating temperature from 0 °C to 85 °C suitable for standard commercial electronics applications.
  • Regulatory  RoHS compliant, supporting electronics manufacturing and environmental compliance requirements.

Unique Advantages

  • High programmable density: The combination of ~32,000 logic elements and 4,000 LABs/CLBs enables significant on-chip integration, reducing the need for external glue logic.
  • Large I/O complement: 450 I/Os allow direct interfacing to multiple peripherals and subsystems without extensive external multiplexing.
  • Embedded memory for local buffering: Approximately 0.34 Mbits of on-chip RAM supports data buffering and small lookup tables close to logic, improving system responsiveness.
  • Compact, manufacturable package: 672-BBGA (672-FPBGA 27×27) in a surface-mount form factor enables high-density PCB designs while maintaining manufacturability.
  • Commercial-grade fit: Rated for 0 °C to 85 °C and RoHS compliant, aligning with standard commercial product requirements.
  • Low-voltage core operation: 1.14 V to 1.26 V supply compatibility supports integration into modern low-voltage power domains.

Why Choose LFE2-35SE-7F672C?

This FPGA is positioned for commercial electronic designs that require substantial logic resources, a large number of I/Os, and on-chip RAM in a compact BGA package. Its combination of approximately 32,000 logic elements, roughly 0.34 Mbits of embedded memory, and 450 I/Os makes it suitable for designers seeking to consolidate functions and reduce board-level complexity.

With a surface-mount 672-BBGA footprint, RoHS compliance, and a commercial operating range, the LFE2-35SE-7F672C delivers a robust platform for scalable digital implementations where board space, I/O count, and programmable capacity are primary considerations.

Request a quote or contact sales to submit a purchase inquiry for the LFE2-35SE-7F672C. Our team can provide pricing, availability, and ordering details to support your design timeline.

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