LFE2-35SE-7F672C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA |
|---|---|
| Quantity | 955 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 450 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-7F672C – ECP2 Field Programmable Gate Array (FPGA) 672-BBGA
The LFE2-35SE-7F672C is a commercial-grade ECP2 family Field Programmable Gate Array (FPGA) delivered in a 672-ball BGA package. It combines a high logic capacity and on-chip memory with a large I/O count to support complex, high-density digital designs that require a compact package and RoHS compliance.
Key Features
- Logic Capacity Approximately 32,000 logic elements providing substantial programmable fabric for implementing custom digital logic and complex control functions. The device data also lists 4,000 LABs/CLBs.
- Embedded Memory Approximately 0.34 Mbits of on-chip RAM (339,968 total RAM bits) for buffering, state storage, and small data sets within the fabric.
- I/O Density Up to 450 user I/Os to support wide parallel interfaces, multiple buses, and mixed-signal front-end connectivity in a single device.
- Power Core supply range of 1.14 V to 1.26 V to match system power architectures that utilize low-voltage FPGA cores.
- Package & Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27 × 27 mm) designed for surface-mount PCB assembly to save board space while providing high pin count.
- Operating Range Commercial operating temperature from 0 °C to 85 °C suitable for standard commercial electronics applications.
- Regulatory RoHS compliant, supporting electronics manufacturing and environmental compliance requirements.
Unique Advantages
- High programmable density: The combination of ~32,000 logic elements and 4,000 LABs/CLBs enables significant on-chip integration, reducing the need for external glue logic.
- Large I/O complement: 450 I/Os allow direct interfacing to multiple peripherals and subsystems without extensive external multiplexing.
- Embedded memory for local buffering: Approximately 0.34 Mbits of on-chip RAM supports data buffering and small lookup tables close to logic, improving system responsiveness.
- Compact, manufacturable package: 672-BBGA (672-FPBGA 27×27) in a surface-mount form factor enables high-density PCB designs while maintaining manufacturability.
- Commercial-grade fit: Rated for 0 °C to 85 °C and RoHS compliant, aligning with standard commercial product requirements.
- Low-voltage core operation: 1.14 V to 1.26 V supply compatibility supports integration into modern low-voltage power domains.
Why Choose LFE2-35SE-7F672C?
This FPGA is positioned for commercial electronic designs that require substantial logic resources, a large number of I/Os, and on-chip RAM in a compact BGA package. Its combination of approximately 32,000 logic elements, roughly 0.34 Mbits of embedded memory, and 450 I/Os makes it suitable for designers seeking to consolidate functions and reduce board-level complexity.
With a surface-mount 672-BBGA footprint, RoHS compliance, and a commercial operating range, the LFE2-35SE-7F672C delivers a robust platform for scalable digital implementations where board space, I/O count, and programmable capacity are primary considerations.
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