LFE2-35SE-6FN672C

The LFE2-35SE-6FN672C is an ECP2 family Field Programmable Gate Array (FPGA) in a 672-ball BGA package designed for commercial embedded designs. It delivers 32,000 logic elements, approximately 0.34 Mbits of on-chip RAM, and up to 450 I/O pins to support high-density programmable logic and interface tasks. Operating from a 1.14 V to 1.26 V core supply and rated for 0 °C to 85 °C, it targets reliable performance in commercial temperature environments.

Key Features

• Core Logic 32,000 logic elements to implement custom logic, state machines, and glue logic within a single device.
• Embedded Memory Approximately 0.34 Mbits of on-chip RAM for data buffering, FIFOs, and small lookup tables.
• I/O Capacity Up to 450 I/O pins to support wide parallel buses, multiple interfaces, and complex board-level connectivity.
• Power Supply Core operating voltage range of 1.14 V to 1.26 V to match system power-rail designs for ECP2-class devices.
• Package & Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27×27) optimized for high-density board layouts; surface-mount mounting.
• Commercial Temperature Grade Specified for 0 °C to 85 °C operation for commercial embedded applications.
• Compliance RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density I/O systems — Use the device’s 450 I/O pins to consolidate multiple parallel and serial interfaces on a single FPGA.
• Embedded control and glue logic — Implement custom controllers, protocol bridges, and timing logic using 32,000 logic elements and embedded RAM.
• Data buffering and packet handling — Leverage on-chip RAM for temporary storage, FIFOs, and small packet buffering in communication and processing tasks.
• Prototyping and custom accelerators — Rapidly iterate hardware logic and implement application-specific accelerators within the programmable fabric.

Unique Advantages

• High logic density: 32,000 logic elements enable substantial logic integration, reducing the need for multiple discrete devices.
• Significant I/O resources: 450 I/O pins simplify board-level interfacing and reduce external multiplexing or expansion components.
• Embedded memory on-chip: Approximately 0.34 Mbits of RAM supports buffering and small data structures without external memory.
• Compact, surface-mount BGA: 672-ball FPBGA (27×27) package allows high-density PCB routing while maintaining a small footprint.
• Commercial readiness: Specified commercial temperature range and RoHS compliance for mainstream embedded product lines.

Why Choose LFE2-35SE-6FN672C?

The LFE2-35SE-6FN672C balances substantial programmable logic capacity, plentiful I/O, and embedded RAM in a compact 672-BBGA package, making it suitable for commercial embedded designs that require integration of multiple interfaces and custom logic. Its defined voltage envelope and temperature rating provide predictable behavior for system design, while RoHS compliance supports common manufacturing and environmental requirements.

Engineers developing interface-heavy systems, custom controllers, or prototype accelerators will find this device a practical choice for consolidating functions and streamlining BOM complexity, with the integration and I/O resources to scale across a range of commercial applications.

Request a quote or submit a sales inquiry to obtain pricing, availability, and further purchase information for the LFE2-35SE-6FN672C.