LFE2-35SE-7FN484C

The LFE2-35SE-7FN484C is a commercial-grade FPGA from the Lattice ECP2 family, optimized for logic-rich system integration and high-performance embedded processing. It combines approximately 32,000 logic elements with on-chip embedded RAM and a broad I/O count to address communications, signal processing and interface-bridging designs.

Package and power characteristics support compact, surface-mount system designs: a 484-ball fpBGA package (23 × 23 mm), a 1.14 V to 1.26 V core supply range, and a commercial operating temperature of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  Approximately 32,000 logic elements (32K LUT-class capacity) for implementing complex logic, state machines and glue logic.
• Embedded Memory  Approximately 339,968 bits (≈0.34 Mbits) of on-chip RAM implemented as EBR blocks; family data for this device lists 18 EBR blocks for block-structured embedded SRAM.
• sysDSP Blocks and Multipliers  Family-defined sysDSP resources are available for high-performance multiply-accumulate tasks; for the ECP2-35 device this includes 8 sysDSP blocks and 32 18×18 multipliers as documented for the family.
• I/O Density  Up to 331 I/O pins in the 484-ball fpBGA package, enabling dense external interface connectivity in a compact surface-mount footprint.
• Clocking and Timing  Family clocking resources include general-purpose PLLs and DLLs; the ECP2-35 device configuration provides two GPLLs and two DLLs for clock management and phase/delay adjustment.
• Flexible I/O and Memory Interfaces  Family-level I/O support includes pre-engineered source-synchronous interfaces, DDR support and multiple programmable I/O voltage standards to simplify interfacing with memories and high-speed peripherals.
• Package & Mounting  484-ball fpBGA (23 × 23 mm) / 484-BBGA supplier package, surface-mount mounting type for modern PCB assembly.
• Power & Temperature  Core supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C.
• Configuration & System Features  The ECP2 family provides flexible configuration options (including SPI boot flash interface and dual boot images); family documentation also describes optional bitstream encryption for "S" series devices.
• Regulatory  RoHS compliant.

Typical Applications

• Networking & Communications  Implement interface logic, protocol bridging and packet processing where a mix of logic density and embedded RAM is required.
• Signal Processing  Leverage sysDSP blocks and on-chip multipliers for fixed-point DSP tasks, filtering and real-time data manipulation.
• Memory Controller & Interface Bridging  Use the device’s source-synchronous I/O and DDR support to implement memory controllers and high-speed external memory interfaces.
• Embedded Control & Glue Logic  Replace multi-chip CPLD/ASIC glue with a single FPGA to consolidate control, bus arbitration and peripheral interfacing.

Unique Advantages

• High logic density with compact package: Offers ~32,000 logic elements in a 484-ball fpBGA, enabling complex designs in a space-constrained board area.
• Integrated DSP and multiplier resources: Family sysDSP blocks and 18×18 multipliers accelerate arithmetic-heavy functions and reduce external hardware.
• Generous I/O in a small form factor: Up to 331 I/Os provide flexible connectivity for peripherals, memories and multi-channel interfaces.
• Flexible on-chip memory: Approximately 0.34 Mbits of embedded RAM across EBR blocks supports buffering, FIFOs and tightly coupled data storage.
• Robust clocking options: On-chip PLLs and DLLs (2 GPLLs + 2 DLLs for this device family selection) simplify multi-clock-domain designs and timing control.
• Commercial-grade, production-ready: Surface-mount fpBGA package and RoHS compliance align with mainstream manufacturing flows and assembly processes.

Why Choose LFE2-35SE-7FN484C?

The LFE2-35SE-7FN484C targets engineers who need a balance of logic capacity, DSP capability and high I/O density in a compact, surface-mount package. With approximately 32,000 logic elements, dedicated sysDSP resources, and about 0.34 Mbits of on-chip RAM, it is suited for designs that require embedded processing, interface bridging and robust timing control.

Backed by the Lattice ECP2 family architecture and family-level configuration features, this device provides a scalable, production-ready platform for communications, signal processing and embedded control applications where commercial-grade operating conditions and RoHS compliance are required.

Request a quote or submit an inquiry for pricing and availability for the LFE2-35SE-7FN484C today.