LFE2-50E-5F484C

The LFE2-50E-5F484C is an ECP2 family field-programmable gate array (FPGA) from Lattice Semiconductor, offered in a 484-BBGA surface-mount package (supplier package: 484-FPBGA, 23×23). This commercial-grade FPGA provides a high integration point with 48,000 logic elements, approximately 0.396 Mbits of on-chip RAM (396,288 bits) and 339 I/O pins, enabling dense logic implementation and extensive external interfacing.

Designed for applications where logic capacity, embedded memory and a high I/O count are key considerations, the device operates from a core supply range of 1.14 V to 1.26 V and across a commercial temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic — 48,000 logic elements for implementing complex digital functions and consolidating multiple logic blocks on a single device.
• Embedded Memory — Approximately 0.396 Mbits of on-chip RAM (396,288 bits) for data buffering, FIFOs and state storage without external memory.
• I/O Capacity — 339 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power — Core voltage supply range of 1.14 V to 1.26 V for defined low-voltage operation.
• Package & Mounting — 484-BBGA package (supplier: 484-FPBGA, 23×23) in a surface-mount form factor for compact board layouts.
• Operating Range — Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance — RoHS compliant, meeting standard environmental requirements for lead-free assembly.

Typical Applications

• High-density I/O systems — The 339 available I/Os support designs requiring multiple parallel interfaces or numerous peripheral connections.
• Embedded logic consolidation — 48,000 logic elements allow integration of control, protocol handling and glue logic into a single FPGA.
• Data buffering and state machines — Approximately 0.396 Mbits of embedded memory supports on-chip buffering, small FIFOs and state retention without immediate external memory.
• Space-constrained boards — The 484-BBGA surface-mount package (23×23) suits compact PCBs where component density is important.

Unique Advantages

• High integration of logic and I/O: Combines 48,000 logic elements with 339 I/Os to reduce the need for multiple discrete devices and simplify board architecture.
• On-chip memory availability: Approximately 0.396 Mbits of embedded RAM reduces dependence on external memory for moderate buffering and state storage.
• Compact, high-density packaging: 484-BBGA (484-FPBGA, 23×23) enables space-efficient layouts for compact designs.
• Predictable core power window: Operates within a defined 1.14 V to 1.26 V core supply range for consistent power planning.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial product requirements.
• RoHS compliance: Conforms to common lead-free environmental requirements for modern assemblies.

Why Choose LFE2-50E-5F484C?

The LFE2-50E-5F484C positions itself as a high-density, commercially graded FPGA option for designs that need significant logic capacity, embedded memory and a large number of I/Os in a compact surface-mount package. Its combination of 48,000 logic elements, roughly 0.396 Mbits of on-chip RAM and 339 I/Os makes it suitable for consolidating multiple digital functions while maintaining a small PCB footprint.

For teams and projects that prioritize integration and board-level density, this device delivers a clear, verifiable set of capabilities and is backed by available ECP2 family documentation for design evaluation and implementation.

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