LFE2-50E-5FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA |
|---|---|
| Quantity | 764 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 339 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFE2-50E-5FN484C – ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA
The LFE2-50E-5FN484C is an ECP2 family field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It delivers 48,000 logic elements, approximately 0.396 Mbits (396,288 bits) of embedded RAM and 339 I/O pins in a 484-ball BGA package.
Designed for commercial-temperature applications, this surface-mount FPGA operates from a 1.14 V to 1.26 V supply and is RoHS compliant, making it suitable for mid-range programmable logic designs that need substantial I/O count and on-chip memory.
Key Features
- Logic Capacity — Provides 48,000 logic elements to implement mid-range programmable logic and control functions.
- Embedded Memory — Approximately 0.396 Mbits (396,288 bits) of on-chip RAM to support data buffering, state storage, and memory-intensive logic tasks.
- I/O Density — 339 general-purpose I/O pins to accommodate complex interfacing and multiple parallel connections.
- Power — Operates from a 1.14 V to 1.26 V supply range, enabling designs that target low-voltage core operation.
- Package and Mounting — Supplied in a 484-BBGA (484-FPBGA, 23 × 23 mm) surface-mount package for space-efficient board integration.
- Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial deployments.
- Environmental Compliance — RoHS compliant for adherence to environmental requirements.
Typical Applications
- Embedded Systems — Implement control logic, peripheral aggregation, and custom interfaces where moderate logic capacity and abundant I/O are required.
- Communications Equipment — Support protocol bridging, parallel data handling, and glue-logic duties that benefit from on-chip RAM and high I/O count.
- Consumer Electronics — Provide programmable logic for feature integration and custom I/O in commercial consumer devices operating within standard temperature ranges.
- Prototyping and Development — Serve as a mid-range FPGA option for evaluation boards and proof-of-concept designs needing significant I/O and embedded memory.
Unique Advantages
- High Logic Integration: 48,000 logic elements enable implementation of substantial programmable logic without external glue logic.
- Significant I/O Count: 339 I/O pins simplify designs that require multiple parallel interfaces or extensive peripheral connections.
- On-Chip RAM: Approximately 0.396 Mbits of embedded memory reduces reliance on external memory for buffering and local data storage.
- Compact Surface-Mount Package: 484-BBGA (23 × 23 mm) package supports dense board layouts while maintaining ample connectivity.
- Low-Voltage Core Operation: 1.14 V to 1.26 V supply range supports modern low-voltage design architectures.
- Regulatory Compliance: RoHS compliance supports environmentally conscious design requirements.
Why Choose LFE2-50E-5FN484C?
The LFE2-50E-5FN484C positions itself as a commercial-grade, mid-range FPGA that balances logic capacity, embedded memory, and an extensive I/O complement in a compact BGA package. Its combination of 48,000 logic elements, substantial on-chip RAM, and 339 I/O pins makes it well suited for designers building systems that require programmable logic, dense interfacing, and local memory resources within standard commercial operating conditions.
As part of the ECP2 family from Lattice Semiconductor Corporation, this device offers a practical option for teams looking to standardize on a mid-range FPGA platform while maintaining RoHS compliance and surface-mount board assembly compatibility.
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