LFE2-50E-5FN484I

The LFE2-50E-5FN484I is an ECP2 family FPGA that provides a programmable logic fabric with 48,000 logic elements, approximately 0.396 Mbits of embedded RAM (396,288 bits) and 339 I/O in a 484‑ball BGA package. It is supplied in a 484‑FPBGA (23×23) surface-mount package and operates from a core voltage range of 1.14 V to 1.26 V.

With an industrial operating temperature range of −40 °C to 100 °C and RoHS compliance, this device targets embedded designs that require significant on-chip logic, memory, and I/O capacity in a compact, surface-mount form factor.

Key Features

• Core Logic 48,000 logic elements provide programmable fabric for implementing custom digital designs and state machines.
• Embedded Memory Approximately 0.396 Mbits of on-chip RAM (396,288 bits) for buffering, FIFOs, and local data storage.
• I/O Density 339 I/O pins support a wide range of external interfaces and peripheral connections.
• Power and Voltage Core supply voltage range of 1.14 V to 1.26 V for tightly specified power domains.
• Package and Mounting 484‑BBGA package (supplier device package: 484‑FPBGA, 23×23) optimized for surface-mount assembly and high pin density.
• Operating Conditions Industrial temperature rating from −40 °C to 100 °C for deployment in thermally demanding environments.
• Environmental Compliance RoHS compliant to support lead‑free assembly requirements.

Typical Applications

• Custom Logic and Prototyping — Leverage 48,000 logic elements and embedded RAM to implement and validate bespoke digital functions and control logic.
• I/O-Intensive Systems — 339 I/O pins enable designs requiring many external connections without extensive external I/O expansion.
• Embedded Industrial Control — Industrial temperature range and compact BGA packaging support robust embedded control and monitoring applications.

Unique Advantages

• High Logic Capacity: 48,000 logic elements enable implementation of complex combinational and sequential logic blocks on-chip.
• Balanced On-Chip Memory: Approximately 0.396 Mbits of RAM provides local storage for buffering and state retention, reducing dependence on external memory for many functions.
• Extensive I/O: 339 I/O pins simplify board-level integration with sensors, peripherals, and external interfaces.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C addresses environmental robustness for industrial deployments.
• Compact, High-Density Package: 484‑BBGA (484‑FPBGA 23×23) delivers high pin count in a compact surface-mount footprint.
• RoHS Compliant: Supports lead-free manufacturing and regulatory requirements.

Why Choose LFE2-50E-5FN484I?

The LFE2-50E-5FN484I combines substantial on-chip logic, memory and I/O capacity with an industrial temperature rating and a high‑density BGA package, making it a practical choice for embedded designs that demand programmable logic and extensive external connectivity. Its defined core voltage range and RoHS compliance simplify power planning and assembly considerations.

This device is well suited to designers and teams building compact, I/O-heavy programmable systems that require on-chip resources and industrial-grade operating conditions, offering scalability within a single-package FPGA solution.

Request a quote or contact sales to discuss pricing, lead times and availability for the LFE2-50E-5FN484I.