LFE2-50E-6F484C

The LFE2-50E-6F484C is an ECP2 Field Programmable Gate Array (FPGA) IC designed for applications that require high logic density, significant on-chip memory, and a large I/O count. With 48,000 logic elements and 339 available I/Os, this device targets designs that need flexible programmable logic combined with compact package integration.

This commercial-grade, surface-mount FPGA operates from a 1.14 V to 1.26 V supply and supports an ambient operating range of 0 °C to 85 °C, making it suitable for typical embedded and electronic product applications where these electrical and environmental conditions are met.

Key Features

• Programmable Logic Core 48,000 logic elements provide a substantial fabric for implementing custom logic, state machines, and combinational/sequential functions.
• Embedded Memory Approximately 0.396 Mbits of embedded memory (396,288 bits) for on-chip buffering, FIFOs, and temporary data storage.
• High I/O Count 339 I/O pins to support wide interfaces, parallel buses, and multiple peripheral connections.
• Power Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling defined power planning for system design.
• Package and Mounting Supplied in a 484-ball BGA package (484-FPBGA, 23 × 23) with surface-mount mounting for compact board-level integration.
• Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard electronic products.
• Regulatory Compliance RoHS-compliant to meet lead-free assembly requirements.

Typical Applications

• High-density logic designs — Leverage 48,000 logic elements to implement complex state machines, custom datapaths, or protocol processing blocks.
• I/O-intensive interfaces — Use 339 I/Os for parallel sensor arrays, multi-channel communications, or wide peripheral buses.
• On-chip data buffering — Rely on approximately 0.396 Mbits of embedded memory for temporary storage, FIFOs, and packet buffering.
• Compact system integration — The 484-ball BGA surface-mount package supports space-constrained board layouts while maintaining a high integration level.

Unique Advantages

• High logic capacity: 48,000 logic elements enable implementation of sizable custom logic without external programmable logic expansion.
• Substantial on-chip memory: Approximately 0.396 Mbits of embedded RAM reduces reliance on external memory for short-term buffering and local storage.
• Extensive I/O support: 339 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA fabric.
• Compact BGA package: 484-ball FPBGA (23 × 23) offers a balance of pin count and board footprint for dense system designs.
• Commercial temperature grading: Rated for 0 °C to 85 °C to match typical electronic product environments.
• RoHS compliance: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose LFE2-50E-6F484C?

The LFE2-50E-6F484C positions itself as a high-density, commercially graded FPGA that combines a large logic fabric, meaningful embedded memory, and an extensive I/O count in a compact BGA package. It is well suited for engineers designing embedded systems and electronic products that require significant programmable logic, local buffering, and multiple external interfaces within standard commercial operating conditions.

Choosing this device provides clear integration advantages—reduced external component count, flexible I/O mapping, and on-chip resources that help simplify board-level design and shorten development cycles.

Request a quote or submit your design requirements to receive pricing and availability information for the LFE2-50E-6F484C FPGA.