LFE2-50E-6F484I

IC FPGA 339 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA

Quantity 654 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O339Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFE2-50E-6F484I – Industrial ECP2 FPGA, 48,000 Logic Elements, 484‑BBGA

The LFE2-50E-6F484I is an industrial‑grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation’s ECP2 family. It combines a high logic capacity with a large I/O count and on‑chip memory in a compact 484‑BBGA surface‑mount package.

This device is positioned for embedded and industrial designs that require substantial logic resources, flexible I/O, and operation across a wide temperature range while maintaining low-voltage core operation.

Key Features

  • Logic Capacity: 48,000 logic elements and 6,000 logic blocks provide significant programmable resources for complex digital functions and custom accelerators.
  • Embedded Memory: Approximately 396 kbits of on‑chip RAM for buffering, state storage, and small data structures directly within the FPGA fabric.
  • I/O Density: 339 general‑purpose I/O pins to support wide connectivity and multiple interface implementations.
  • Package and Mounting: 484‑BBGA package (23×23 mm) in a surface‑mount format, with supplier device package listed as 484‑FPBGA (23×23).
  • Power: Core supply voltage range of 1.14 V to 1.26 V for low‑voltage operation.
  • Industrial Temperature Range: Rated for operation from −40 °C to 100 °C, suitable for harsh and industrial environments.
  • Compliance: RoHS compliant to meet environmental and regulatory requirements.

Unique Advantages

  • High logic density: 48,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
  • Substantial I/O capability: 339 I/Os allow direct interfacing to many peripherals and multiple parallel interfaces without auxiliary I/O expanders.
  • On‑chip RAM: Approximately 396 kbits of embedded memory supports local buffering and state retention, reducing reliance on external memory for small data sets.
  • Industrial reliability: Rated for −40 °C to 100 °C operation, supporting deployment in temperature‑challenging applications.
  • Compact, manufacturable package: 484‑BBGA (23×23) surface‑mount package balances I/O count and PCB footprint for space‑constrained designs.
  • Low‑voltage core: 1.14 V to 1.26 V supply range helps reduce overall power draw in system designs.

Why Choose LFE2-50E-6F484I?

The LFE2-50E-6F484I provides a balanced combination of logic density, I/O capacity, and embedded memory in a rugged industrial package. Its specifications make it well suited to engineers seeking to integrate substantial programmable logic and high connectivity into a compact, surface‑mount footprint while maintaining operation across a wide temperature range.

With RoHS compliance and a defined core voltage range, this FPGA supports designs where environmental conformity and predictable power characteristics are important. It is an appropriate choice for teams looking to scale functional complexity without increasing board count or external componentry.

Request a quote or submit an inquiry to get pricing and availability for the LFE2-50E-6F484I. Our team can provide lead‑time details and support to help integrate this FPGA into your next design.

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