LFE2-50E-6FN484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA |
|---|---|
| Quantity | 938 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 339 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFE2-50E-6FN484I – ECP2 FPGA, 48,000 Logic Elements, 484-BBGA
The LFE2-50E-6FN484I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It delivers a substantial logic footprint with 48,000 logic elements and a broad I/O count, making it suitable for complex control, data-path, and interface functionality within industrial and embedded systems.
Key attributes include on-chip embedded memory, a high-density 484-ball BGA package, a narrow core supply range, and extended operating temperature support, enabling reliable operation in demanding environments.
Key Features
- Logic Capacity — Provides 48,000 logic elements supported by 6,000 CLBs to implement custom digital functions and parallel processing pipelines.
- Embedded Memory — Approximately 0.396 Mbits of on-chip RAM (396,288 bits) for buffering, FIFOs, and small-data storage without external memory.
- I/O Density — 339 user I/Os to interface with sensors, peripherals, transceivers, and board-level peripherals.
- Package & Mounting — Supplied in a 484-ball BBGA package (supplier package: 484-FPBGA, 23 × 23) for high-density board integration; surface-mount mounting type.
- Power — Core supply operating range of 1.14 V to 1.26 V for defined power domain planning.
- Industrial Temperature Range — Rated for operation from −40°C to 100°C, supporting deployment in industrial and harsh-temperature environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial Control Systems — Use the FPGA to implement custom motor control, PLC logic, and real-time signal processing functions that benefit from the device’s 48,000 logic elements and extended temperature rating.
- Embedded Networking & Interfaces — Leverage 339 I/Os to bridge and implement protocol conversion, multi‑lane interfaces, and glue logic between heterogeneous sub-systems.
- Data Acquisition & Signal Conditioning — Deploy on-chip memory and dense logic resources for aggregation, buffering, and pre-processing of sensor data in industrial measurement applications.
Unique Advantages
- Large Logic Footprint: 48,000 logic elements enable complex custom hardware acceleration and parallel processing without immediate need for larger devices.
- High I/O Count: 339 I/Os simplify board-level routing and reduce the need for external multiplexing or expanders.
- Embedded RAM Availability: Approximately 0.396 Mbits of on-chip RAM provides space for buffering and local data storage, reducing external memory dependency for many applications.
- Industrial Temperature Support: −40°C to 100°C rating supports deployment in industrial environments where extended temperature operation is required.
- Compact, High-Density Packaging: 484-BBGA (23 × 23 FPBGA supplier package) balances pin count and board-area efficiency for space-constrained designs.
- Regulatory Compliance: RoHS compliance supports use in products targeting restricted-substance requirements.
Why Choose LFE2-50E-6FN484I?
The LFE2-50E-6FN484I positions itself as a capable mid-to-high density FPGA option for engineers who need substantial logic resources, a high I/O count, and on-chip memory in an industrial-grade device. Its defined core voltage range and extended operating temperature make it suitable for robust embedded and industrial designs.
Manufactured by Lattice Semiconductor Corporation, this device is appropriate for development teams designing custom control logic, interface bridges, and signal-processing tasks where integration density, dependable temperature operation, and board-level I/O flexibility are priorities.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016