LFE2-50E-6FN672C

The LFE2-50E-6FN672C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial applications. It combines a high logic capacity with substantial on-chip memory and an extensive I/O count in a compact BGA package.

This device is suited for commercial embedded systems and communications equipment where a balance of integration, I/O density, and low-voltage operation is required. Its specifications enable consolidated logic, memory, and I/O functions on a single device to simplify board-level design.

Key Features

• Core Logic  48,000 logic elements provide broad programmable logic capacity for complex combinational and sequential designs.
• Embedded Memory  Approximately 396,288 bits (~0.396 Mbits) of on-chip RAM to support buffering, FIFOs, and small data stores.
• I/O Density  500 device I/Os offer extensive connectivity for parallel interfaces, peripherals, and board-level signaling.
• Power  Low-voltage supply range of 1.14 V to 1.26 V for core operation.
• Package & Mounting  672-ball BGA package (listed as 672-BBGA / 672-FPBGA, 27 × 27 mm) with surface-mount mounting for compact board integration.
• Operating Conditions & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.

Typical Applications

• Prototyping and Development  Use the FPGA’s sizable logic resources and on-chip memory to implement and iterate custom digital designs quickly.
• High-Density I/O Systems  Support extensive peripheral interfacing and parallel bus implementations with up to 500 I/Os.
• Embedded Logic Integration  Consolidate glue logic, protocol bridging, and control functions on a single device to reduce component count.
• Compact Board-Level Solutions  The 672-ball BGA surface-mount package enables high-density board placement for space-constrained commercial products.

Unique Advantages

• High Logic Capacity: 48,000 logic elements support complex designs and multiple functional blocks on one device.
• Large I/O Count: 500 I/Os enable extensive connectivity options without external multiplexing.
• On-Chip Memory: Approximately 396,288 bits of embedded RAM reduce dependence on external memory for mid-sized buffering needs.
• Low-Voltage Core: 1.14 V to 1.26 V supply range supports modern low-voltage system architectures.
• Compact BGA Packaging: 672-ball, 27 × 27 mm package provides a high-pin-count footprint while keeping board area efficient.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, matching typical commercial product requirements.

Why Choose LFE2-50E-6FN672C?

The LFE2-50E-6FN672C delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact surface-mount BGA package for commercial designs. Its feature set supports consolidation of digital functions, rich peripheral connectivity, and mid-sized buffering needs while operating at a low core voltage.

This FPGA is well suited to engineers and teams building commercial embedded systems, communications equipment, or compact board-level solutions who require scalable logic capacity, a high number of I/Os, and a compact form factor.

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