LFE2-50E-6FN672I

The LFE2-50E-6FN672I is an ECP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It combines a high logic capacity with abundant I/O and on-chip memory to support complex, high-density embedded designs.

Key attributes include 48,000 logic elements, approximately 0.396 Mbits of embedded memory, up to 500 I/Os, and an industrial operating temperature range, delivering a balance of integration and robustness for demanding environments.

Key Features

• Core Capacity  48,000 logic elements provide substantial programmable logic resources for medium-to-large FPGA designs.
• Configurable Logic Blocks (CLBs)  6,000 CLBs enable structured implementation of combinational and sequential logic for diverse application needs.
• Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (396,288 bits) for buffering, FIFOs, and small data storage requirements.
• High I/O Count  Up to 500 I/Os support extensive peripheral interfacing and parallel connectivity within compact system designs.
• Package & Mounting  672-BBGA package (supplier device package: 672-FPBGA, 27×27) in a surface-mount form factor for dense board integration.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for industrial-temperature deployments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Systems  Use in industrial control and automation where the industrial temperature grade and FPGA capacity support robust, long-life deployments.
• High‑Density I/O Systems  Ideal for designs requiring large numbers of external interfaces, leveraging up to 500 I/Os for parallel sensors, buses, or peripheral arrays.
• Embedded Processing and Control  Suitable for embedded control tasks that need substantial programmable logic and on-chip memory for deterministic processing.
• Communications and Networking Equipment  Applicable in network and communications modules that benefit from flexible logic, plentiful I/O, and compact packaging.

Unique Advantages

• Highly integrated logic capacity: 48,000 logic elements and 6,000 CLBs reduce the need for external glue logic and simplify system architecture.
• Large I/O count: Up to 500 I/Os enables direct interfacing to many peripherals and sensors without additional multiplexing hardware.
• Compact, assembly-friendly package: 672‑BBGA / 672‑FPBGA (27×27) surface-mount package supports high-density PCB layouts while maintaining manufacturability.
• Industrial temperature rating: −40°C to 100°C operation supports deployment in industrial environments with wide thermal variation.
• Controlled core voltage window: 1.14 V to 1.26 V core supply simplifies power-supply planning for low-voltage systems.
• Regulatory compliance: RoHS compliance facilitates use in products targeting markets that require restricted-substance conformance.

Why Choose LFE2-50E-6FN672I?

The LFE2-50E-6FN672I is positioned for designers who need substantial programmable logic, a high I/O count, and an industrial temperature envelope in a compact surface-mount package. Its combination of 48,000 logic elements, approximately 0.396 Mbits of embedded memory, and up to 500 I/Os provides the integration required to simplify board-level design and reduce component count.

From industrial control and high-density I/O systems to embedded processing and communications modules, this FPGA offers a balanced mix of capacity and environmental robustness for long-term deployments, supported by Lattice Semiconductor Corporation manufacturing and documentation.

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