LFE2-50E-7FN672C

The LFE2-50E-7FN672C is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial electronic designs that require programmable logic, substantial I/O capacity, and on-chip memory. It provides 48,000 logic elements, approximately 0.396 Mbits of embedded RAM, and up to 500 user I/O pins to support complex interfacing and custom logic functions.

This device operates from a core supply of 1.14 V to 1.26 V, is supplied in a surface-mount 672-BBGA package (672-FPBGA, 27×27 mm), and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic  48,000 logic elements for implementing mid-range FPGA designs and custom logic functions.
• Embedded Memory  Approximately 0.396 Mbits of on-chip RAM to support buffering, FIFOs, and small lookup tables within the fabric.
• I/O Capacity  Up to 500 user I/O pins, enabling high-density interface and parallel connectivity for complex systems.
• Power  Core voltage range of 1.14 V to 1.26 V for integration into low-voltage system power rails.
• Package & Mounting  672-BBGA (supplier package: 672-FPBGA, 27×27 mm) in a surface-mount form factor suitable for compact board layouts.
• Temperature & Grade  Commercial operating range of 0 °C to 85 °C, targeted at consumer and commercial electronics applications.
• Environmental Compliance  RoHS compliant, meeting common regulations for lead-free assemblies.

Typical Applications

• High-density I/O bridging  Use the 500 I/O pins to implement interface bridging, signal routing, and translation between multiple peripherals and buses.
• Protocol and peripheral control  Deploy the 48,000 logic elements to implement custom protocol handlers, peripheral interfaces, and glue logic for embedded systems.
• Data buffering and small-memory processing  On-chip RAM provides local buffering and temporary storage for packet handling, streaming data, or FIFO-based flows.
• Commercial electronics and communications equipment  The combination of logic density, I/O count, and compact BGA packaging makes it suitable for space-constrained commercial devices and communication modules.

Unique Advantages

• High logic density: 48,000 logic elements deliver the capacity to implement substantial custom logic and processing within a single device, reducing the need for external ASICs or multiple FPGAs.
• Extensive I/O: Up to 500 user I/Os enable broad interfacing options for multi-channel and mixed-signal front ends without additional I/O expanders.
• On-chip memory: Approximately 0.396 Mbits of embedded RAM supports buffering and small data structures directly in the FPGA fabric for lower system latency.
• Compact surface-mount BGA: The 672-BBGA (672-FPBGA, 27×27 mm) package minimizes PCB footprint while maintaining high pin count for dense designs.
• Low-voltage core operation: 1.14 V to 1.26 V core supply aligns with modern low-voltage power domains for efficient integration.
• Regulatory-ready assembly: RoHS compliance supports lead-free manufacturing requirements for commercial electronics.

Why Choose LFE2-50E-7FN672C?

The LFE2-50E-7FN672C positions itself as a mid-range, commercially graded FPGA for designers who need a balance of programmable logic capacity, significant I/O density, and embedded memory in a compact BGA package. Its specification set—48,000 logic elements, ~0.396 Mbits RAM, 500 I/Os, and low-voltage core operation—supports a wide range of custom logic, interface, and buffering tasks in commercial electronic and communications products.

As part of the ECP2 family from Lattice Semiconductor Corporation, this device is suitable for engineers and procurement teams aiming to consolidate board-level functionality, reduce BOM complexity, and implement scalable, reprogrammable logic in commercial applications where a 0 °C to 85 °C operating range and RoHS compliance are required.

Request a quote today to check pricing and availability for LFE2-50E-7FN672C and to evaluate how it fits your next design.