LFE2-50SE-5F484C

IC FPGA 339 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA

Quantity 347 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O339Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFE2-50SE-5F484C – ECP2 Field Programmable Gate Array (FPGA)

The LFE2-50SE-5F484C is an FPGA device from Lattice Semiconductor Corporation in the ECP2 family. It provides programmable logic resources, on-chip RAM and a high I/O count in a compact 484-ball BGA package, designed for commercial-temperature applications.

This device targets designs that require mid-density programmable logic, embedded memory and significant I/O connectivity while operating within a 0 °C to 85 °C range and a core supply window of 1.14 V to 1.26 V.

Key Features

  • Core Logic 48,000 logic elements and 6,000 CLBs provide mid-density programmable logic capacity for a wide range of designs.
  • Embedded Memory Approximately 0.396 Mbits of on-chip RAM (396,288 total RAM bits) for local buffering, FIFOs and small data stores.
  • I/O Connectivity 339 user I/O pins to support multiple parallel interfaces and external peripherals.
  • Power Core supply voltage range of 1.14 V to 1.26 V to match system power domains and regulator selection.
  • Package & Mounting 484-ball FBGA (484-BBGA / 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board integration.
  • Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Compliance RoHS-compliant, meeting common lead-free assembly requirements.

Typical Applications

  • High‑I/O Interface Control Use the 339 I/O pins to implement parallel interfaces, bus bridging or multiple peripheral connections.
  • Embedded Logic and Glue 48,000 logic elements support mid-density glue logic, protocol translation and custom control functions.
  • On‑chip Data Buffering Approximately 0.396 Mbits of embedded RAM for buffering, small lookup tables or temporary storage in data paths.

Unique Advantages

  • Balanced Logic and Memory A combination of 48,000 logic elements and nearly 0.396 Mbits of RAM enables integrated implementations without large external memory requirements.
  • High I/O Count 339 I/O pins simplify designs that require multiple parallel interfaces or dense peripheral connections.
  • Compact BGA Package 484-ball FPBGA (23 × 23 mm) offers a high-density mounting option for space-constrained boards.
  • Commercial Temperature Range Rated 0 °C to 85 °C to match typical commercial electronic product environments.
  • RoHS Compliant RoHS status supports lead-free manufacturing and regulatory compliance requirements.

Why Choose LFE2-50SE-5F484C?

The LFE2-50SE-5F484C delivers a mid-density FPGA option with a practical balance of logic, embedded RAM and a high I/O count in a compact 484-ball BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a broad range of consumer and industrial-facing electronic designs that require programmable logic integration.

This device is well suited for engineers and procurement teams seeking a Lattice Semiconductor FPGA that fits designs needing significant I/O and on-chip memory while maintaining a compact board footprint and defined supply and temperature requirements.

Request a quote or contact sales to obtain pricing, lead times and additional ordering information for the LFE2-50SE-5F484C.

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