LFE2-50SE-5F484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA |
|---|---|
| Quantity | 556 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 339 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFE2-50SE-5F484I – ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA
The LFE2-50SE-5F484I is an ECP2 family Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package. It combines a substantial logic capacity with embedded RAM and a high I/O count, and is specified for industrial-grade operation.
This device is suited to designs that need on-chip programmable logic with support for many external interfaces, low-voltage operation, and an extended temperature range for industrial environments.
Key Features
- Logic Capacity 48,000 logic elements provide significant programmable logic resources for complex designs.
- Logic Blocks 6,000 logic blocks deliver structured resources for partitioning and implementing logic functions.
- Embedded Memory Approximately 0.4 Mbits of on-chip RAM (396,288 bits) for data buffering, FIFOs, and small memory structures.
- I/O Density 339 I/O pins to support multiple external interfaces and parallel connections.
- Power Operates from a core supply range of 1.14 V to 1.26 V for low-voltage core operation.
- Package & Mounting 484-ball FBGA package (484-BBGA / supplier package 484-FPBGA 23×23) in a surface-mount form factor for high-density board designs.
- Temperature Range & Grade Industrial grade operation with an ambient range of −40 °C to 100 °C for demanding environments.
- Standards Compliance RoHS compliant.
Typical Applications
- Industrial Control Systems Industrial-grade temperature rating and extensive I/O make the device suitable for control logic, sensor aggregation, and factory automation interfaces.
- High-Density I/O Gateways With 339 I/Os, the FPGA can consolidate multiple peripheral interfaces or bridge parallel data paths.
- Embedded Logic and Glue 48,000 logic elements and on-chip RAM support custom protocol handling, timing adaptation, and glue logic between subsystems.
Unique Advantages
- Substantial Logic Resource: 48,000 logic elements enable implementation of sizeable logic functions and parallel datapaths without external CPLDs.
- Compact High-Density Packaging: 484-ball FBGA (23×23) provides a small footprint for complex designs while accommodating many I/Os.
- Industrial Temperature Qualification: Specified for −40 °C to 100 °C operation to meet the needs of temperature-challenging deployments.
- Integrated On-Chip Memory: Approximately 0.4 Mbits of embedded RAM for buffering, state machines, and small data stores reduces dependence on external memory.
- Low-Voltage Core Operation: Core supply range of 1.14 V to 1.26 V supports designs targeting modern low-voltage domains.
- RoHS Compliant: Meets RoHS environmental requirements for lead-free manufacturing processes.
Why Choose LFE2-50SE-5F484I?
The LFE2-50SE-5F484I positions itself as a versatile industrial-grade FPGA option that balances extensive logic resources, embedded memory, and a high I/O count in a compact 484-ball BGA package. Its low-voltage core and extended temperature range make it appropriate for board-level designs that require reliable programmable logic in challenging environments.
This device is well suited for engineers designing industrial control, interface consolidation, and embedded logic solutions where on-chip resources and robust environmental specifications are primary considerations.
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