LFE2-50SE-5F672I

The LFE2-50SE-5F672I is an ECP2-series Field Programmable Gate Array (FPGA) offered in a 672-ball BGA package for surface-mount integration. It combines a high I/O count with a substantial logic capacity and embedded RAM for custom digital logic, interfacing and control functions in industrial environments.

Key on-chip resources include 48,000 logic elements, approximately 0.396 Mbits of embedded memory, and up to 500 I/O pins. The device supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, and is RoHS compliant.

Key Features

• Logic Capacity  48,000 logic elements to implement complex custom logic, signal processing and glue-logic functions.
• Embedded Memory  Approximately 0.396 Mbits of on-chip RAM for data buffering, FIFOs and small lookup tables.
• High I/O Count  Up to 500 I/O pins to support extensive peripheral interfacing and multi-channel connectivity.
• Power and Core Supply  Core voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package and Mounting  672-BBGA (supplier package: 672-FPBGA 27×27) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory Compliance  RoHS compliant for material and soldering process requirements.

Typical Applications

• Industrial Control and Automation  Use the device’s industrial temperature range, high I/O count and logic resources to implement motor drives, machine control logic and real-time interfacing.
• Embedded Signal Processing  Leverage 48,000 logic elements and on-chip RAM for custom signal conditioning, filtering and protocol bridging within embedded systems.
• High-Density I/O Aggregation  Deploy as an I/O concentrator or bridge where many parallel signals or mixed I/O standards must be managed on a single FPGA.

Unique Advantages

• Large Logic Resource Pool: 48,000 logic elements enable implementation of complex finite-state machines, datapaths and custom accelerators without external logic.
• Significant On-Chip Memory: Approximately 0.396 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
• Extensive I/O Capacity: Up to 500 I/O pins simplify board-level routing for multi-channel interfaces and peripheral expansion.
• Industrial Temperature Capability: Rated from -40 °C to 100 °C to support deployment in harsher operating environments.
• Compact Surface-Mount Package: 672-BBGA (27×27 FPBGA) balances pin density with PCB real estate for space-constrained designs.
• RoHS Compliance: Conforms to RoHS material requirements for modern manufacturing processes.

Why Choose LFE2-50SE-5F672I?

The LFE2-50SE-5F672I positions itself as a versatile FPGA option where a high I/O count, substantial logic capacity and industrial temperature resilience are required. Its combination of 48,000 logic elements and embedded memory supports a wide range of custom logic and interfacing tasks while the 672-ball BGA package enables compact, surface-mount integration.

This device is well suited for design teams building industrial and embedded systems that need scalable logic resources, flexible I/O, and operation across a broad temperature range—delivering a practical balance of integration and robustness for long-term deployments.

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