LFE2-50SE-5FN672I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 500 396288 48000 672-BBGA |
|---|---|
| Quantity | 150 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 500 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFE2-50SE-5FN672I – ECP2 FPGA IC, 500 I/O, 48k Logic Elements, 672-BBGA
The LFE2-50SE-5FN672I is an ECP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It combines a large logic fabric with substantial on-chip RAM and a high I/O count in a compact 672-BBGA package.
Engineered for industrial environments, this device supports a wide operating temperature range and low-voltage core operation, making it suitable for designs that require high integration, robust I/O capability, and embedded memory close to the logic.
Key Features
- Core & Logic Approximately 48,000 logic elements provide a flexible fabric for implementing custom digital logic, state machines, and control functions.
- Embedded Memory Approximately 0.396 Mbits of on-chip RAM (396,288 total RAM bits) for buffering, lookup tables, and state storage without external memory.
- I/O Capacity Up to 500 I/O pins support extensive peripheral interfacing and multi-channel connectivity in complex systems.
- Power Core supply voltage range of 1.14 V to 1.26 V for low-voltage operation.
- Package & Mounting 672-BBGA package (supplier device package: 672-FPBGA 27×27) in a surface-mount form factor for dense board-level integration.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C, suitable for demanding environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Systems Interfaces sensors and actuators and implements deterministic control logic while operating across an industrial temperature range.
- High-Density I/O Systems Aggregates multiple peripherals and buses using the device's 500 I/O pins for complex connectivity and board-level consolidation.
- Embedded Memory-Dependent Logic Uses approximately 0.396 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables to reduce external memory needs.
- Custom Logic and Protocol Bridging Implements tailored state machines and interface translation in compact, surface-mount hardware designs.
Unique Advantages
- High logic capacity: Approximately 48,000 logic elements enable implementation of sizable custom hardware functions on a single device, reducing board count.
- Substantial I/O integration: Up to 500 I/O pins allow direct connection to many peripherals and interfaces, simplifying system routing and PCB layout.
- On-chip RAM for local buffering: Nearly 0.396 Mbits of embedded memory helps minimize external memory components and lowers system latency.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsher environments common in industrial applications.
- Compact BGA footprint: 672-BBGA (27×27) surface-mount package balances high pin count with a small PCB area.
- Low-voltage core: 1.14 V to 1.26 V supply range supports modern low-power system architectures.
Why Choose LFE2-50SE-5FN672I?
The LFE2-50SE-5FN672I positions itself as a highly integrated FPGA suited to designs that demand a balance of logic capacity, on-chip memory, and extensive I/O in an industrial-grade package. Its combination of roughly 48,000 logic elements, nearly 0.396 Mbits of embedded RAM, and 500 I/O pins enables consolidation of multiple board-level functions into a single device.
Designed and manufactured by Lattice Semiconductor Corporation, this device is appropriate for embedded system designers and engineers building industrial controls, high-density interfaces, or custom logic solutions that require reliable operation across a wide temperature range and a compact BGA package.
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