LFE2-50SE-6F672C

The LFE2-50SE-6F672C is an ECP2 Field Programmable Gate Array (FPGA) in a 672-BBGA package. It provides a combination of on-chip logic and embedded memory with a large user I/O count for designs that require dense interfacing and programmable logic resources.

Key electrical and mechanical characteristics include approximately 48,000 logic elements, roughly 0.396 Mbits of embedded RAM (396,288 bits), up to 500 user I/Os, a 1.14–1.26 V core supply range, surface-mount 672-FPBGA (27×27) packaging, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core and Logic  Approximately 48,000 logic elements organized across 6,000 logic blocks for implementing combinational and sequential logic resources.
• Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (396,288 bits) to support buffering, FIFOs, and small data stores without external memory.
• I/O Density  Up to 500 user I/Os to support high-pin-count interfaces and multiple parallel connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for core power planning and voltage rail design.
• Package & Mounting  672-BBGA package in the supplier device package 672-FPBGA (27×27) format; surface-mount mounting type for standard PCB assembly.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Embedded control and system logic  Implement glue logic, control state machines, and custom processing pipelines using the device's logic elements and on-chip RAM.
• High-density I/O interfacing  Use the 500 available I/Os to aggregate and bridge multiple parallel interfaces or to support extensive sensor and peripheral connectivity.
• Memory-buffering functions  Leverage the on-chip RAM for buffering, FIFO operations, and small data storage without immediate reliance on external memory.
• Evaluation and prototyping  Deploy in development platforms where a 672-BBGA footprint and the specified logic and I/O resources match target system requirements.

Unique Advantages

• High logic capacity: Approximately 48,000 logic elements enable implementation of substantial custom logic and control functions on a single device.
• Significant embedded RAM: ~0.396 Mbits of on-chip memory reduces dependence on external memory for buffering and small-data tasks.
• Extensive I/O count: Up to 500 user I/Os support complex interfacing and parallel connections without external multiplexing.
• Compact surface-mount BGA package: 672-FPBGA (27×27) packaging offers a dense footprint suitable for space-constrained PCBs while maintaining high pin count.
• Commercial operating range: 0 °C to 85 °C rating aligns with general-purpose, commercial designs.
• RoHS compliant: Meets lead-free and hazardous substance requirements for regulated assemblies.

Why Choose LFE2-50SE-6F672C?

The LFE2-50SE-6F672C positions itself as a practical choice for designs that require a balance of logic capacity, embedded memory, and a very high I/O count within a compact 672-BBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of general-purpose embedded applications.

Engineers and procurement teams seeking a programmable logic device with around 48,000 logic elements, approximately 396,288 bits of on-chip RAM, and up to 500 I/Os will find this FPGA aligns with designs that need dense interfacing and moderate on-chip resources. Refer to the ECP2 family documentation for further technical details and device family characteristics.

Request a quote or contact our sales team to get pricing, availability, and lead-time information for the LFE2-50SE-6F672C.