LFE2-50SE-6F672I

The LFE2-50SE-6F672I is an ECP2 family Field Programmable Gate Array (FPGA) device offering a high density of programmable logic and on-chip memory in a compact 672-ball BGA package. Designed for industrial-grade applications, this device integrates 48,000 logic elements, approximately 0.396 Mbits of embedded memory, and up to 500 I/O pins to support complex, high-pin-count designs.

With a low-voltage core supply range and a wide operating temperature window, the LFE2-50SE-6F672I is intended for systems that require significant logic integration, moderate embedded memory, and a large number of external interfaces in a surface-mount package.

Key Features

• Core Logic 48,000 logic elements provide substantial programmable logic capacity for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.396 Mbits of on-chip RAM for data buffering, state storage, and small memory blocks directly within the FPGA fabric.
• I/O Capacity Up to 500 user I/O pins to support high-pin-count interfacing with peripherals, sensors, and external memory or logic.
• Power Supply Core voltage range from 1.14 V to 1.26 V, enabling operation within a defined low-voltage domain.
• Package & Mounting 672-ball BGA (supplier package: 672-FPBGA, 27 × 27 mm) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade Industrial-grade device specified for an operating temperature range of -40°C to 100°C, suitable for deployed industrial environments.
• Environmental Compliance RoHS compliant, supporting regulatory-driven design choices for reduced hazardous materials.

Unique Advantages

• High Logic Density: 48,000 logic elements enable implementation of complex custom logic and multiple functional blocks on a single device, reducing the need for external ASICs or discrete logic.
• Large I/O Count: 500 I/O pins allow flexible connection to numerous peripherals and high-bandwidth external interfaces without multiple interface expanders.
• Compact, High‑Pin Package: The 672-ball BGA (672-FPBGA, 27×27) packs high pin count into a compact footprint for space-constrained boards.
• Industrial Temperature Range: Rated from -40°C to 100°C to meet environmental demands of industrial deployments.
• Low-Voltage Core Operation: Narrow core voltage range (1.14 V–1.26 V) supports consistent power-domain design and integration with modern low-voltage systems.
• RoHS Compliance: Environmentally compliant construction simplifies adherence to regional material-restriction regulations.

Why Choose LFE2-50SE-6F672I?

The LFE2-50SE-6F672I positions itself as a robust, industrial-grade FPGA option for engineers needing substantial programmable logic, a high I/O count, and onboard RAM in a compact BGA package. Its combination of 48,000 logic elements, approximately 0.396 Mbits of embedded memory, and 500 I/Os makes it well suited to designs that require dense integration of custom digital logic and numerous external interfaces.

With a defined low-voltage supply and an extended operating temperature range, this device supports reliable operation in industrial environments while maintaining a compact footprint via the 672-ball FPBGA (27×27) package.

If you would like pricing, availability, or to request a quote for the LFE2-50SE-6F672I, please submit a quote request or sales inquiry describing your quantity and delivery requirements.