LFE2-50SE-6FN672C

The LFE2-50SE-6FN672C is a commercial-grade field programmable gate array (FPGA) from Lattice Semiconductor’s ECP2 family. It combines high logic capacity and dense I/O in a compact 672-ball BGA package, making it suitable for embedded system integration, high-density I/O bridging, and communication interface designs.

Built on the ECP2 family architecture, the device provides a balance of logic resources, on-chip memory and flexible I/O with low-voltage operation, enabling designers to implement complex control, interface and signal-processing functions within a single programmable device.

Key Features

• Logic Capacity — 48,000 logic elements to implement medium-to-high complexity logic and control functions.
• On‑Chip Memory — 396,288 bits of total embedded RAM for storage, buffering and small memory structures within the fabric.
• I/O Density — Up to 500 I/Os to support wide interface parallelism and multi-channel connectivity.
• Power — Operating supply range of 1.14 V to 1.26 V for core power domains.
• Package — 672-ball FBGA (672-BBGA / 672-FPBGA, 27 × 27 mm) in a surface-mount form factor for compact board designs.
• Operating Range — Commercial temperature grade with operating range 0 °C to 85 °C.
• Mounting & Compliance — Surface mount device; RoHS compliant for environmental compatibility.
• Family-level Capabilities — As part of the Lattice ECP2 family, the device is designed to support advanced features found across the family such as embedded DSP blocks, flexible embedded block RAM configurations, PLL/DLL clock resources and source-synchronous I/O support.

Typical Applications

• Communications Modules — Implement protocol bridging, interface aggregation and moderate-rate packet processing where high I/O count and programmable logic are required.
• Embedded Control — Replace discrete logic in control and coordination tasks for appliances, consumer electronics and industrial equipment operating within commercial temperature ranges.
• Memory Interface and Buffering — Use on-chip RAM and abundant I/O to implement memory controllers, buffering and data path staging for system-level designs.
• Signal Processing & DSP Functions — Leverage the ECP2 family’s DSP-oriented architecture to accelerate fixed-point signal-processing tasks and aggregation of multiple lower-speed channels.
• Prototyping & System Integration — Compact package and extensive I/O make the device suitable for board-level prototyping and consolidating multiple functions into a single programmable component.

Unique Advantages

• High logic and I/O density: 48,000 logic elements combined with 500 I/Os supports complex designs and extensive external connectivity without large footprint tradeoffs.
• Embedded memory for on-chip buffering: 396,288 bits of RAM reduce the need for external memory in many control and data-path applications.
• Compact, manufacturable package: 672-ball FBGA (27 × 27 mm) provides a small board area with surface-mount compatibility for modern assembly processes.
• Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern low-voltage system power domains.
• Commercial temperature grade and RoHS compliance: Suitable for mainstream electronic products and environmentally compliant production.
• Part of a supported FPGA family: Family-level design resources and tooling support help accelerate development and integration.

Why Choose LFE2-50SE-6FN672C?

The LFE2-50SE-6FN672C is positioned for designers who need substantial logic density, broad I/O capability and on-chip memory in a compact, commercial-grade FPGA package. Its specification set—including 48,000 logic elements, nearly 400 Kbits of embedded RAM, 500 I/Os and a 672-ball FBGA—makes it well suited to consolidate multiple board-level functions into a single programmable device, simplify system architecture and shorten development cycles.

As a member of the Lattice ECP2 family, the device benefits from family-level architecture choices that emphasize DSP blocks, flexible memory and clocking resources, and source-synchronous I/O support—helping teams create scalable, maintainable designs supported by vendor documentation and design tooling.

Request a quote or submit an inquiry for LFE2-50SE-6FN672C to check availability, pricing and lead times for your next design project.