LFE2-50SE-7F672C

IC FPGA 500 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 500 396288 48000 672-BBGA

Quantity 56 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O500Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFE2-50SE-7F672C – ECP2 Field Programmable Gate Array (FPGA), 48K Logic Elements, 500 I/Os, 672-BBGA

The LFE2-50SE-7F672C is a commercial-grade FPGA from Lattice Semiconductor's LatticeECP2 family. It delivers a balanced combination of logic density, embedded memory and flexible I/O in a 672-ball BGA package for system integration and mid-range FPGA designs.

With approximately 48,000 logic elements, roughly 396,288 bits of on-chip RAM and up to 500 I/Os, this device targets applications that require high I/O count, moderate embedded memory and advanced programmable I/O and clocking resources while operating from a 1.14 V to 1.26 V core supply.

Key Features

  • Logic Capacity — Approximately 48,000 logic elements to support mid-size to complex logic implementations and system integration.
  • Embedded Memory — Approximately 396,288 bits of on-chip RAM for buffering, FIFOs and on-chip data storage.
  • I/O Density — Up to 500 user I/Os to support wide parallel interfaces and multiple I/O banks in a single device.
  • Programmable I/O Support — Family-level support for a wide range of interface standards and source-synchronous I/O features for DDR and high-speed parallel links (as described in the LatticeECP2/M family data sheet).
  • DSP and Clocking Resources — Family features include sysDSP blocks and multiple analog PLLs/DLLs for multiply-accumulate operations and flexible clocking (refer to family data sheet for block counts and configurations).
  • Package and Mounting — 672-ball FPBGA (27 × 27 mm) package, surface-mount construction for compact board-level integration.
  • Operating Conditions — Commercial grade: 0 °C to 85 °C ambient operating temperature; core supply range 1.14 V to 1.26 V.
  • Regulatory — RoHS compliant.

Typical Applications

  • Networking & Communications — Implement protocol bridging, packet processing or interface aggregation where high I/O counts and embedded memory are required.
  • Embedded Signal Processing — Use the device’s DSP and on-chip RAM resources for filtering, buffering and real-time data manipulation in midsize signal-processing tasks.
  • Board-Level Interface Management — Consolidate multiple parallel and serial interfaces using the high I/O count and programmable I/O buffers.
  • Memory Interface Control — Support DDR-type memory interfaces and source-synchronous designs using the family’s dedicated DDR and DQS support (see family data sheet for details).

Unique Advantages

  • High I/O scalability: 500 available I/Os enable broad interface support and reduce the need for external bridge logic.
  • Substantial on-chip memory: Nearly 396 Kbits of embedded RAM supports local buffering and reduces external memory bandwidth requirements.
  • Robust logic capacity: Approximately 48K logic elements accommodate complex finite-state machines, datapaths and glue logic in a single device.
  • Compact package: 672-ball FPBGA (27 × 27 mm) allows dense board-level integration while maintaining high I/O counts.
  • Design ecosystem: The LatticeECP2 family is supported by the manufacturer’s device families and tool ecosystem, facilitating implementation and scaling across related parts (refer to the family data sheet for tool support).

Why Choose LFE2-50SE-7F672C?

The LFE2-50SE-7F672C positions itself as a versatile mid-range FPGA offering a balance of logic density, embedded memory and very high I/O capability in a compact 672-ball BGA package. It is suited to system designers who need to consolidate interfaces, implement moderate DSP and buffering tasks, and minimize external component count while operating in commercial temperature ranges.

Backed by the LatticeECP2 family feature set and documentation, this device is appropriate for projects that require predictable performance, a broad set of I/O options and established design tool support. Its combination of resources helps teams scale designs within the same family and simplify board-level integration.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the LFE2-50SE-7F672C.

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