LFE2-6E-5F256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA |
|---|---|
| Quantity | 908 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 190 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 750 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFE2-6E-5F256I – ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA
The LFE2-6E-5F256I is an ECP2 family FPGA from Lattice Semiconductor Corporation. It provides reprogrammable digital logic resources in a compact BGA package for industrial-grade embedded applications.
Key attributes include 6000 logic elements, 56,320 bits of on-chip RAM, 190 I/O pins, a low-voltage supply range of 1.14 V to 1.26 V, and an industrial operating temperature range of −40 °C to 100 °C—making it suitable for designs that require moderate logic capacity, local memory, and extensive interfacing in a surface-mount package.
Key Features
- Core Logic 6000 logic elements for implementing custom digital functions and glue logic.
- Embedded Memory 56,320 bits of on-chip RAM for buffering, FIFOs, and small data storage needs.
- I/O Density 190 I/O pins to support multiple parallel interfaces and signal aggregation.
- Power Operates from a 1.14 V to 1.26 V supply range to align with low-voltage system rails.
- Package & Mounting 256-BGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB placement.
- Temperature Range Industrial grade operation from −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Systems Implement custom control logic and real-time interfacing using the FPGA’s logic resources and extensive I/O count.
- Embedded Processing Integrate reconfigurable logic and local RAM in space-constrained embedded designs with the compact 256-BGA package.
- Communications and I/O Aggregation Route and bridge multiple signals or protocols using the high I/O complement and on-chip resources.
Unique Advantages
- High I/O capacity in a compact footprint: 190 I/O pins from a 256-BGA package enable dense connectivity without large packages.
- Industrial temperature rating: Rated for −40 °C to 100 °C to support operation in harsher environments.
- Low-voltage compatibility: 1.14–1.26 V supply range allows integration with modern low-voltage systems.
- On-chip RAM availability: 56,320 bits of embedded memory reduce reliance on external RAM for buffering and control storage.
- RoHS compliance: Helps meet environmental regulations for hazardous substance reduction.
Why Choose LFE2-6E-5F256I?
The LFE2-6E-5F256I positions itself as a practical, industrial-grade FPGA choice for designs requiring moderate logic capacity, local RAM, and a high I/O count in a compact surface-mount package. Manufactured by Lattice Semiconductor Corporation, it combines reprogrammable logic and on-chip resources with an industrial temperature rating for dependable operation.
This device is well suited for engineers and procurement teams building embedded, industrial control, or communications modules that need reconfigurable logic, local memory, and extensive interfacing while maintaining a small PCB footprint.
Request a quote or contact sales to check availability and pricing for LFE2-6E-5F256I.

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