LFE2-6E-5F256I

IC FPGA 190 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA

Quantity 908 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O190Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs750Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFE2-6E-5F256I – ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA

The LFE2-6E-5F256I is an ECP2 family FPGA from Lattice Semiconductor Corporation. It provides reprogrammable digital logic resources in a compact BGA package for industrial-grade embedded applications.

Key attributes include 6000 logic elements, 56,320 bits of on-chip RAM, 190 I/O pins, a low-voltage supply range of 1.14 V to 1.26 V, and an industrial operating temperature range of −40 °C to 100 °C—making it suitable for designs that require moderate logic capacity, local memory, and extensive interfacing in a surface-mount package.

Key Features

  • Core Logic 6000 logic elements for implementing custom digital functions and glue logic.
  • Embedded Memory 56,320 bits of on-chip RAM for buffering, FIFOs, and small data storage needs.
  • I/O Density 190 I/O pins to support multiple parallel interfaces and signal aggregation.
  • Power Operates from a 1.14 V to 1.26 V supply range to align with low-voltage system rails.
  • Package & Mounting 256-BGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB placement.
  • Temperature Range Industrial grade operation from −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Industrial Control Systems Implement custom control logic and real-time interfacing using the FPGA’s logic resources and extensive I/O count.
  • Embedded Processing Integrate reconfigurable logic and local RAM in space-constrained embedded designs with the compact 256-BGA package.
  • Communications and I/O Aggregation Route and bridge multiple signals or protocols using the high I/O complement and on-chip resources.

Unique Advantages

  • High I/O capacity in a compact footprint: 190 I/O pins from a 256-BGA package enable dense connectivity without large packages.
  • Industrial temperature rating: Rated for −40 °C to 100 °C to support operation in harsher environments.
  • Low-voltage compatibility: 1.14–1.26 V supply range allows integration with modern low-voltage systems.
  • On-chip RAM availability: 56,320 bits of embedded memory reduce reliance on external RAM for buffering and control storage.
  • RoHS compliance: Helps meet environmental regulations for hazardous substance reduction.

Why Choose LFE2-6E-5F256I?

The LFE2-6E-5F256I positions itself as a practical, industrial-grade FPGA choice for designs requiring moderate logic capacity, local RAM, and a high I/O count in a compact surface-mount package. Manufactured by Lattice Semiconductor Corporation, it combines reprogrammable logic and on-chip resources with an industrial temperature rating for dependable operation.

This device is well suited for engineers and procurement teams building embedded, industrial control, or communications modules that need reconfigurable logic, local memory, and extensive interfacing while maintaining a small PCB footprint.

Request a quote or contact sales to check availability and pricing for LFE2-6E-5F256I.

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