LFE2-6E-5F256C

The LFE2-6E-5F256C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for commercial embedded applications. It delivers a balance of logic capacity, on-chip memory and I/O density in a compact BGA package for custom logic, interface bridging and control functions.

Key attributes include 6,000 logic elements, 56,320 bits of embedded RAM, up to 190 I/O and a 256-ball BGA footprint, making it suitable for space-constrained commercial designs that require moderate programmable logic and flexible I/O.

Key Features

• Core  6,000 logic elements and 750 logic blocks provide the programmable fabric for implementing custom logic, state machines and peripheral interfaces.
• Memory  56,320 bits of on-chip RAM (embedded memory) for data buffering, FIFOs and small lookup tables.
• I/O  190 general-purpose I/O pins to support multiple external interfaces and peripheral connections.
• Power  Supports a supply voltage range of 1.14 V to 1.26 V for core operation.
• Package & Mounting  256-ball BGA package (supplier package: 256-FPBGA, 17 × 17 mm) with surface-mount mounting for compact PCB integration.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory  RoHS compliant for environmental regulatory adherence in commercial products.

Typical Applications

• Embedded and OEM systems  Implement custom control logic, peripheral integration and glue-logic in compact commercial devices.
• Interface bridging  Use the FPGA’s 190 I/O and programmable fabric to translate or aggregate signals between sensors, controllers and host interfaces.
• Communications and networking equipment  Provide protocol adaptation, packet processing offload or custom I/O handling in space-constrained modules.
• Prototyping and product development  Evaluate custom logic implementations and iterate designs before finalizing production hardware.

Unique Advantages

• Right-sized logic capacity: 6,000 logic elements offer a practical balance for moderate-complexity designs without oversizing the bill of materials.
• High I/O density: 190 I/O pins enable multiple peripheral connections and flexible interface options on a single device.
• Compact BGA footprint: The 256-ball (256-FPBGA, 17 × 17 mm) package enables high-density PCB integration for space-limited assemblies.
• Embedded RAM for buffering: 56,320 bits of on-chip memory support small data buffers, FIFOs and lookup tables directly in the FPGA fabric.
• Commercial-grade operating range: Rated for 0 °C to 85 °C operation to match typical commercial environment requirements.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory alignment in product assemblies.

Why Choose LFE2-6E-5F256C?

The LFE2-6E-5F256C positions itself as a compact, commercially graded FPGA option for developers needing a balanced mix of logic, memory and I/O in a small BGA package. Its combination of 6,000 logic elements, 190 I/O and on-chip RAM makes it well suited to commercial embedded systems, interface bridging and communications modules where board space and integration matter.

Backed by Lattice Semiconductor Corporation, this part provides a predictable, specification-driven option for OEMs and design teams building mid-complexity programmable logic into their products.

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