LFE2-50SE-7F484C

IC FPGA 339 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA

Quantity 1,305 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O339Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFE2-50SE-7F484C – ECP2 FPGA, 48,000 logic elements, 339 I/O, 484-BBGA

The LFE2-50SE-7F484C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a programmable logic fabric with 48,000 logic elements and a broad I/O count to implement custom digital functions.

With approximately 0.396 Mbits of embedded memory, a 339-pin I/O capability, and a compact 484-ball BGA package, this device is suited to designs that require dense logic, flexible I/O routing, and surface-mount packaging within a commercial temperature range.

Key Features

  • Core Logic  48,000 logic elements provide substantial programmable capacity for glue logic, protocol bridging, and custom state machines.
  • Embedded Memory  Approximately 0.396 Mbits (396,288 bits) of on-chip RAM for data buffering, FIFOs, and small lookup tables.
  • I/O Capability  339 user I/O pins to support wide parallel interfaces, multiple serial lanes, and flexible connectivity options.
  • Package  484-BBGA (Supplier device package: 484-FPBGA, 23×23) offering a compact surface-mount footprint for space-constrained PCBs.
  • Power  Core supply range of 1.14 V to 1.26 V to match system power-rail designs.
  • Temperature and Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
  • Assembly  Surface mount package for standard SMT assembly flow.
  • Compliance  RoHS compliant, meeting common lead-free materials requirements.

Typical Applications

  • Embedded Systems  Implement custom control logic, protocol adaptation, or peripheral aggregation using the device’s 48,000 logic elements and abundant I/O.
  • Interface Bridging  Use the 339 I/O pins and on-chip RAM to bridge between high-pin-count parallel buses or multiple serial interfaces.
  • Prototyping and Development  A programmable FPGA fabric with substantial logic and memory density for early-stage system validation and feature iteration.
  • Space-Constrained Designs  The 484-ball BGA (23×23) package enables high-density integration on compact PCBs while retaining significant I/O and logic resources.

Unique Advantages

  • High Logic Density:  48,000 logic elements enable complex designs without external glue logic, reducing BOM and board complexity.
  • Generous I/O Count:  339 user I/Os support multiple parallel interfaces or a mix of interfaces without external multiplexing.
  • On-Chip Memory for Data Handling:  Approximately 0.396 Mbits of embedded RAM supports buffering and small data storage tasks directly in the FPGA fabric.
  • Compact BGA Package:  484-BBGA (484-FPBGA, 23×23) balances I/O availability with a space-efficient footprint for modern PCB layouts.
  • Controlled Power Requirements:  A defined core voltage window of 1.14 V to 1.26 V simplifies power-supply design and system integration.
  • RoHS Compliance:  Meets lead-free material requirements for environmentally conscious designs and common regulatory compliance needs.

Why Choose LFE2-50SE-7F484C?

The LFE2-50SE-7F484C positions itself as a flexible, mid-capacity FPGA option offering a balance of logic density, embedded memory, and a high I/O count in a compact 484-ball BGA package. Its defined core voltage range and commercial operating temperature make it suitable for a wide range of standard electronic products and development projects.

This device is appropriate for engineers and teams building solutions that require significant programmable logic and many I/Os while maintaining a compact board footprint. Backed by Lattice Semiconductor Corporation’s ECP2 family architecture attributes, it supports scalable implementation and straightforward integration into surface-mount manufacturing flows.

Request a quote or submit an inquiry today to discuss pricing, availability, and how the LFE2-50SE-7F484C can meet your design requirements.

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