LFE2-50SE-7F484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA |
|---|---|
| Quantity | 1,305 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 339 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFE2-50SE-7F484C – ECP2 FPGA, 48,000 logic elements, 339 I/O, 484-BBGA
The LFE2-50SE-7F484C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a programmable logic fabric with 48,000 logic elements and a broad I/O count to implement custom digital functions.
With approximately 0.396 Mbits of embedded memory, a 339-pin I/O capability, and a compact 484-ball BGA package, this device is suited to designs that require dense logic, flexible I/O routing, and surface-mount packaging within a commercial temperature range.
Key Features
- Core Logic 48,000 logic elements provide substantial programmable capacity for glue logic, protocol bridging, and custom state machines.
- Embedded Memory Approximately 0.396 Mbits (396,288 bits) of on-chip RAM for data buffering, FIFOs, and small lookup tables.
- I/O Capability 339 user I/O pins to support wide parallel interfaces, multiple serial lanes, and flexible connectivity options.
- Package 484-BBGA (Supplier device package: 484-FPBGA, 23×23) offering a compact surface-mount footprint for space-constrained PCBs.
- Power Core supply range of 1.14 V to 1.26 V to match system power-rail designs.
- Temperature and Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
- Assembly Surface mount package for standard SMT assembly flow.
- Compliance RoHS compliant, meeting common lead-free materials requirements.
Typical Applications
- Embedded Systems Implement custom control logic, protocol adaptation, or peripheral aggregation using the device’s 48,000 logic elements and abundant I/O.
- Interface Bridging Use the 339 I/O pins and on-chip RAM to bridge between high-pin-count parallel buses or multiple serial interfaces.
- Prototyping and Development A programmable FPGA fabric with substantial logic and memory density for early-stage system validation and feature iteration.
- Space-Constrained Designs The 484-ball BGA (23×23) package enables high-density integration on compact PCBs while retaining significant I/O and logic resources.
Unique Advantages
- High Logic Density: 48,000 logic elements enable complex designs without external glue logic, reducing BOM and board complexity.
- Generous I/O Count: 339 user I/Os support multiple parallel interfaces or a mix of interfaces without external multiplexing.
- On-Chip Memory for Data Handling: Approximately 0.396 Mbits of embedded RAM supports buffering and small data storage tasks directly in the FPGA fabric.
- Compact BGA Package: 484-BBGA (484-FPBGA, 23×23) balances I/O availability with a space-efficient footprint for modern PCB layouts.
- Controlled Power Requirements: A defined core voltage window of 1.14 V to 1.26 V simplifies power-supply design and system integration.
- RoHS Compliance: Meets lead-free material requirements for environmentally conscious designs and common regulatory compliance needs.
Why Choose LFE2-50SE-7F484C?
The LFE2-50SE-7F484C positions itself as a flexible, mid-capacity FPGA option offering a balance of logic density, embedded memory, and a high I/O count in a compact 484-ball BGA package. Its defined core voltage range and commercial operating temperature make it suitable for a wide range of standard electronic products and development projects.
This device is appropriate for engineers and teams building solutions that require significant programmable logic and many I/Os while maintaining a compact board footprint. Backed by Lattice Semiconductor Corporation’s ECP2 family architecture attributes, it supports scalable implementation and straightforward integration into surface-mount manufacturing flows.
Request a quote or submit an inquiry today to discuss pricing, availability, and how the LFE2-50SE-7F484C can meet your design requirements.

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