LFE2-50SE-6FN672I

The LFE2-50SE-6FN672I is an ECP2 family Field Programmable Gate Array (FPGA) provided in a 672-ball BGA package. It delivers a combination of on-chip logic, embedded memory, and a high I/O count for designs that require substantial programmable logic resources and interfacing capacity.

With 48,000 logic elements, approximately 0.396 Mbits of embedded memory, and 500 I/O pins, this industrial-grade FPGA is intended for systems that need dense logic implementation, significant on-chip RAM, and wide connectivity within a surface-mount footprint.

Key Features

• Core Architecture  ECP2 family FPGA architecture in a 672-ball BGA package supporting programmable logic implementation.
• Logic Capacity  48,000 logic elements for implementing complex control, state machines, and glue logic.
• Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (396,288 total RAM bits) for data buffering, frame storage, and local memory functions.
• I/O Density  500 available I/O pins to support extensive external interfacing and multi-channel connectivity.
• Package  672-BBGA (supplier device package 672-FPBGA, 27 × 27 mm) providing a compact surface-mount form factor for board-level integration.
• Power  Core voltage supply range from 1.14 V to 1.26 V to match system power-rail requirements.
• Operating Range  Industrial temperature rating of −40 °C to 100 °C for deployment in a wide range of environmental conditions.
• Mounting and Compliance  Surface-mount device with RoHS compliance for lead-free assembly processes.

Typical Applications

• High-density I/O systems  Use the 500 I/O pins to aggregate multiple external interfaces and sensors on a single FPGA.
• Embedded logic and glue  Implement control functions, protocol bridging, and custom logic with 48,000 logic elements.
• On-chip buffering and data staging  Leverage approximately 0.396 Mbits of embedded memory for local data storage and buffering needs.
• Industrial control equipment  Deploy in systems requiring an industrial operating temperature range and surface-mount integration.

Unique Advantages

• Substantial logic resources: 48,000 logic elements allow consolidation of multiple functions into a single programmable device, reducing external component count.
• High I/O capacity: 500 I/O pins support dense connectivity and simplify board-level routing for multi-channel systems.
• On-chip embedded memory: Approximately 0.396 Mbits of RAM enables local data retention and buffering without immediate reliance on external memory.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation across a wide range of ambient conditions.
• Compact package: 672-BBGA (27 × 27 mm) provides a balance of pin count and board footprint for space-constrained designs.
• RoHS-compliant surface-mount device: Suited for modern lead-free assembly processes and automated PCB production.

Why Choose LFE2-50SE-6FN672I?

The LFE2-50SE-6FN672I positions a significant amount of programmable logic, embedded memory, and I/O density within a single industrial-grade, surface-mount BGA package. Its combination of 48,000 logic elements, roughly 0.396 Mbits of on-chip RAM, and 500 I/O pins makes it well suited for designs that require integrated logic, wide connectivity, and reliable operation across an extended temperature range.

This part is a practical choice for engineers and procurement teams building compact, high-function-count systems that benefit from on-chip memory and substantial I/O without increasing board area or component count. Its RoHS compliance and surface-mount form factor support modern manufacturing and assembly workflows.

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