LFE2-50SE-7FN672C

The LFE2-50SE-7FN672C is a commercial-grade ECP2 Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. It provides a high-density programmable logic resource with 48,000 logic elements and approximately 0.396 Mbits of embedded memory for implementing custom digital functions.

With up to 500 I/O, a 672-ball BGA package (supplier package: 672-FPBGA, 27×27), and a low-voltage core supply range of 1.14 V to 1.26 V, this device targets designs that require substantial logic capacity, significant on-chip RAM, and dense external connectivity within a commercial temperature range.

Key Features

• Logic Capacity — 48,000 logic elements providing substantial programmable logic resources for complex digital implementations.
• Configurable Logic Blocks (CLBs) — 6,000 CLBs for structured logic mapping and implementation.
• Embedded Memory — Approximately 0.396 Mbits of on-chip RAM (396,288 total RAM bits) to support data buffering and local storage.
• I/O Density — Up to 500 I/O pins to support wide peripheral connectivity and parallel interfaces.
• Power — Core supply voltage specified from 1.14 V to 1.26 V to match low-voltage system designs.
• Package and Mounting — 672-BBGA package (supplier: 672-FPBGA, 27×27) with surface-mount mounting for compact board integration.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-Density I/O Systems — Use the 500 I/O pins to interface with multiple peripherals, sensors, or parallel buses requiring dense connectivity.
• Embedded Logic and Control — Implement custom control logic and state machines using the 48,000 logic elements and structured CLBs.
• On-Chip Data Buffering — Leverage approximately 0.396 Mbits of embedded RAM for local buffering, FIFOs, or small lookup tables.
• Compact Board Designs — The 672-BBGA (27×27) surface-mount package supports high-density board layouts where board space is constrained.

Unique Advantages

• Substantial Logic Resources: 48,000 logic elements enable implementation of complex digital functions without external ASICs or additional FPGAs.
• Integrated Memory: Nearly 0.396 Mbits of embedded RAM reduces the need for external memory for many buffering and state-holding tasks.
• High I/O Count: Up to 500 I/O pins simplify system-level connectivity and reduce the need for additional I/O expanders.
• Compact Surface-Mount Package: 672-BBGA (672-FPBGA, 27×27) supports dense PCB layouts and modern assembly processes.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products.
• RoHS Compliant: Meets RoHS requirements for lead-free manufacturing processes.

Why Choose LFE2-50SE-7FN672C?

The LFE2-50SE-7FN672C combines substantial logic density, on-chip RAM, and high I/O capacity in a compact 672-BBGA surface-mount package. Its low-voltage core and commercial operating range make it well suited to board-level designs that require significant programmable logic and local memory without sacrificing PCB real estate.

This device is a practical choice for engineers developing commercial electronic systems that need scalable logic resources, dense connectivity, and integrated memory to simplify designs and reduce bill-of-materials complexity.

Request a quote or submit a pricing and availability inquiry to evaluate the LFE2-50SE-7FN672C for your next design.