LFE2-6E-5FN256C

The LFE2-6E-5FN256C is an ECP2 family Field Programmable Gate Array (FPGA) IC supplied in a 256-ball FBGA package. It provides 6,000 logic elements, 56,320 bits of on-chip RAM and 190 I/O pins in a commercial-grade, surface-mount package.

With a nominal core voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device targets commercial electronic designs requiring moderate logic capacity, embedded memory and a compact 17×17 256-FPBGA footprint.

Key Features

• Core Logic — 6,000 logic elements provide the programmable fabric for custom digital logic and control functions.
• Embedded Memory — 56,320 total RAM bits available for on-chip data storage and buffering needs.
• I/O Capacity — 190 general-purpose I/O pins support broad interfacing options for peripherals and external devices.
• Power — Core supply range 1.14 V to 1.26 V to match system power rails and enable predictable power integration.
• Package & Mounting — 256-FPBGA (17×17) package in a surface-mount form factor for dense board-level integration.
• Temperature & Grade — Commercial-grade operation from 0 °C to 85 °C; RoHS compliant for environmental compatibility.

Typical Applications

• Commercial Embedded Systems — Use the device to implement custom control logic and data handling in commercial electronics where moderate logic density and on-chip RAM are required.
• Interface Concentration — 190 I/Os enable consolidation of multiple peripheral interfaces and signal routing in compact designs.
• Custom Timing and Control — Deploy the FPGA for glue logic, protocol translation, and timing-control tasks that benefit from reprogrammable logic and embedded memory.

Unique Advantages

• Balanced Logic and Memory: 6,000 logic elements combined with 56,320 bits of RAM deliver a practical balance of programmable logic and embedded storage for many commercial applications.
• High I/O Count: 190 I/O pins provide flexibility to interface with multiple sensors, peripherals and off-chip devices without external multiplexing.
• Compact Package: The 256-FPBGA (17×17) package allows dense board integration while maintaining a high pin count.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial environments.
• RoHS Compliant: Meets environmental compliance expectations for commercial product manufacturing.

Why Choose LFE2-6E-5FN256C?

The LFE2-6E-5FN256C positions itself as a practical, commercial-grade FPGA option that combines 6,000 logic elements, substantial on-chip RAM and 190 I/Os in a compact 256-FPBGA package. Its defined core voltage range and standard commercial temperature rating make it straightforward to integrate into mid-density, board-level designs.

This part is well suited for designers seeking a programmable solution that balances logic capacity, embedded memory and interface flexibility while maintaining a compact footprint and RoHS compliance.

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