LFE2-6E-5T144C

The LFE2-6E-5T144C is a field programmable gate array (FPGA) device providing moderate logic density and on-chip memory in a compact surface-mount package. It pairs 750 configurable logic blocks (CLBs) and approximately 6,000 logic elements with 56,320 bits of embedded RAM to address general-purpose FPGA design needs.

With 90 I/O pins, a 144-LQFP / 144-TQFP (20×20) supplier package option, low-voltage operation (1.14–1.26 V), and commercial operating temperature range (0 °C to 85 °C), this device is aimed at designers requiring balanced logic, I/O, and memory resources in a space-efficient form factor.

Key Features

• Core Logic  750 configurable logic blocks (CLBs) and 6,000 logic elements provide moderate logic capacity for custom digital designs.
• Embedded Memory  Approximately 0.056 Mbits (56,320 bits) of on-chip RAM for lookup tables, FIFOs, or small data buffers.
• I/O  90 general-purpose I/O pins suitable for interfacing with peripherals, sensors, and external logic.
• Power  Supported voltage supply range of 1.14 V to 1.26 V for core operation, enabling low-voltage system integration.
• Package & Mounting  144-LQFP package case; supplier device package listed as 144-TQFP (20×20). Surface-mount mounting type simplifies PCB assembly.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom logic and prototyping  Implement moderate-density custom logic functions and prototypes using 6,000 logic elements and 750 CLBs.
• Peripheral and interface control  Use the 90 I/O pins to bridge or manage multiple peripheral interfaces and discrete I/O requirements on a single chip.
• On-board buffering and small data storage  Leverage approximately 56,320 bits of embedded RAM for small buffers, FIFOs, or temporary data storage within embedded designs.

Unique Advantages

• Balanced logic and I/O density: Combines 6,000 logic elements with 90 I/O pins to support designs that need both compute resources and connectivity without excessive board-level routing.
• Compact surface-mount package: 144-LQFP/144-TQFP (20×20) package provides a space-efficient footprint for PCB layouts and assembly.
• Low-voltage core operation: 1.14–1.26 V supply range supports integration into low-voltage power architectures.
• Embedded memory on-chip: Approximately 0.056 Mbits of RAM enables local data buffering and state storage without external memory components.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet standard commercial product requirements.
• RoHS compliant: Meets environmental compliance expectations for many commercial production programs.

Why Choose LFE2-6E-5T144C?

The LFE2-6E-5T144C offers a practical combination of logic capacity, on-chip memory, and I/O in a 144-pin surface-mount package, making it a suitable choice for moderate-density FPGA designs where board space, power, and integration matter. Its commercial temperature rating and RoHS compliance align with typical commercial product development and production processes.

This device is appropriate for designers seeking a compact FPGA solution that balances logic elements, embedded RAM, and I/O count to streamline board-level integration and reduce the need for external components.

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