LFE2-6E-5FN256I

The LFE2-6E-5FN256I is a field programmable gate array (FPGA) IC from the ECP2 family designed for mid-density, I/O-rich designs. It combines approximately 6,000 logic elements with on-chip memory and a high I/O count to address configurable logic needs in industrial environments.

Its value proposition is focused on integration and reliability: a 256-ball BGA package and industrial operating temperature range enable compact board designs that operate across a wide temperature window, while the available logic and memory resources support customized control, interfacing, and data buffering functions.

Key Features

• Core Logic  Approximately 6,000 logic elements provide mid-density programmable logic capacity suitable for custom control and data-path implementations.
• Configurable Logic Blocks (CLBs)  750 CLBs support the organization of logic into structured, reusable blocks for efficient mapping of designs.
• Embedded Memory  56,320 bits of on-chip RAM offer local buffering and storage for packet handling, FIFOs, or intermediate data storage.
• I/O Density  190 available I/O pins enable extensive peripheral interfacing and signal routing for multi-channel systems.
• Package  256-FPBGA (17×17) / 256-BGA package provides a compact surface-mount form factor suited to space-constrained designs.
• Power  Low core voltage range of 1.14 V to 1.26 V allows integration into designs with modern low-voltage power rails.
• Industrial Temperature Rating  Qualified for operation from −40 °C to 100 °C, supporting deployment in industrial and harsh-environment applications.
• Mounting and Compliance  Surface-mount device with RoHS compliance for modern assembly processes and environmental standards.

Typical Applications

• Industrial Control  Custom logic, I/O aggregation, and deterministic control functions in factory automation and process equipment leveraging industrial temperature capability.
• Data Acquisition & I/O Expansion  Buffering, preprocessing, and protocol bridging for multi-channel sensor arrays and distributed I/O systems using on-chip RAM and high I/O count.
• Embedded System Prototyping  Mid-density FPGA resources enable rapid development and validation of custom digital functions and interfaces before production implementation.

Unique Advantages

• High I/O Count: 190 I/O pins allow extensive peripheral and bus connectivity without external multiplexers, simplifying board-level design.
• Balanced Logic and Memory: Approximately 6,000 logic elements paired with 56,320 bits of RAM enable both control logic and local buffering within a single device.
• Industrial Reliability: −40 °C to 100 °C operating range supports sustained operation in challenging environments.
• Compact Packaging: 256-FPBGA (17×17) package minimizes PCB footprint while providing robust soldered connections for production assemblies.
• Low-Voltage Core: 1.14–1.26 V core supply range fits low-voltage power architectures commonly used in modern embedded systems.
• Standards-Ready Assembly: Surface-mount construction and RoHS compliance align with contemporary manufacturing and environmental requirements.

Why Choose LFE2-6E-5FN256I?

The LFE2-6E-5FN256I positions itself as a mid-density, industrial-grade FPGA option that balances logic capacity, embedded memory, and a high number of I/Os in a compact 256-BGA package. Its specifications make it suitable for designers who need configurable logic and on-chip buffering in space-constrained, temperature-demanding applications.

Choose this device when your design requires a reliable, RoHS-compliant FPGA with substantial I/O connectivity and on-chip resources — ideal for industrial control, data acquisition, and embedded prototyping where integration and operating range matter.

Request a quote or contact sales to discuss availability, pricing, and how LFE2-6E-5FN256I can fit your next design.