LFE2-6E-6F256I

The LFE2-6E-6F256I is a field programmable gate array (FPGA) IC from the Lattice ECP2 family. It provides a balanced combination of logic capacity, embedded memory and DSP resources in a compact 256-ball fpBGA package for space-constrained, I/O‑rich designs.

Designed for industrial applications, this device targets embedded systems, communications interfaces and signal processing tasks where a 6,000‑element logic fabric, extensive I/O and industrial temperature operation are required.

Key Features

• Logic Capacity  Approximately 6,000 logic elements (cells) suitable for mid-density system integration and glue‑logic functions.
• Embedded Memory  Total on‑chip RAM of 56,320 bits (approximately 55 Kbits) plus distributed RAM resources (12 Kbits for this device), enabling local buffer and state storage.
• DSP Resources  Includes sysDSP resources with 3 DSP blocks and support for multiple 18×18 multipliers (12 available on this device) for common multiply/accumulate workloads.
• I/O Density  Up to 190 user I/Os for wide external connectivity and parallel interface support.
• Clocking  Device-level clock management includes two general‑purpose PLLs and two DLLs to support clock multiplication, division and phase adjustments.
• Package & Mounting  256-ball fpBGA (256‑FPBGA, 17×17 mm) surface‑mount package for compact board-level integration.
• Power  Core supply range specified from 1.14 V to 1.26 V for the FPGA fabric.
• Industrial Reliability  Rated for industrial operating temperatures from −40 °C to 100 °C and classified as industrial grade.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  I/O‑heavy control nodes and PLC subsystems benefit from the 190 I/Os, industrial temperature rating and compact BGA footprint.
• Signal Processing  On‑chip DSP blocks and multiple 18×18 multipliers support filtering, transforms and other real‑time numeric processing tasks.
• Embedded Systems  Mid‑density logic, embedded RAM and flexible clocking make the device suitable for custom SoC glue logic, protocol bridging and control tasks.
• Communications Interfaces  High I/O count and programmable logic allow implementation of interface handling and protocol adaptation functions in communications equipment.

Unique Advantages

• Balanced mid‑density logic: 6,000 logic elements provide ample capacity for moderate complexity designs without excess overhead.
• On‑chip memory and DSP: Approximately 55 Kbits of embedded RAM, 12 Kbits distributed RAM and dedicated DSP blocks reduce external memory needs and accelerate signal processing tasks.
• High I/O count: Up to 190 I/Os enable broad peripheral and bus connectivity on a single device.
• Compact, manufacturable package: 256‑ball fpBGA (17×17 mm) surface‑mount package supports dense PCB layouts while easing assembly.
• Industrial operating range: −40 °C to 100 °C rating and industrial grade classification support deployment in demanding environments.
• Controlled core supply: Specified 1.14–1.26 V core voltage range aligns with modern low‑voltage FPGA power architectures.

Why Choose LFE2-6E-6F256I?

The LFE2-6E-6F256I delivers a practical mix of logic, embedded memory and DSP resources in a compact 256‑ball fpBGA package targeted at industrial and embedded applications. Its 6,000 logic elements, on‑chip RAM and DSP blocks let designers consolidate functions, reduce external parts count and implement real‑time processing workflows.

This device is suited to engineers who need a mid‑density, industrial‑grade FPGA with high I/O capacity and robust clocking resources. It offers a scalable option within the ECP2 family for customers focused on integration, reliability and manufacturable packaging.

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