LFE2-6E-6FN256C

The LFE2-6E-6FN256C is an ECP2 family Field Programmable Gate Array (FPGA) IC targeted at commercial embedded designs requiring reconfigurable logic. It combines a mid-range logic capacity with embedded RAM and a high I/O count in a compact 256-BGA package.

With 6,000 logic elements, 56,320 bits of on-chip RAM and up to 190 I/O, this device is positioned for commercial applications that need integrated digital logic, moderate embedded memory, and a dense pinout within a small-footprint surface-mount package.

Key Features

• Core Logic  6,000 logic elements provide a balanced fabric for implementing control, glue logic, and moderate-complexity datapaths.
• Embedded Memory  56,320 bits of on-chip RAM support buffering, small lookup tables and state storage without external memory.
• I/O Density  Up to 190 user I/O pins allow connection to multiple peripherals, buses and interfaces from a single device.
• Power  Specified supply range of 1.14 V to 1.26 V supports low-voltage system architectures.
• Package  256-FPBGA (17 × 17 mm) surface-mount package provides a high pin count in a compact footprint suitable for space-constrained designs.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Compliance  RoHS-compliant to support environmentally regulated product builds.

Typical Applications

• Commercial embedded systems  Implements control logic and state machines where a commercial-grade FPGA with 6,000 logic elements and on-chip RAM is required.
• I/O‑intensive interfaces  Bridges and interface controllers that benefit from up to 190 dedicated I/O pins for sensors, communication links or peripheral buses.
• Compact, high-density designs  Systems requiring a high pin count in a compact package can leverage the 256-FPBGA (17×17) package to conserve PCB area.
• Prototyping and evaluation  Rapid hardware prototyping where moderate logic capacity and embedded RAM enable proof-of-concept implementations on a commercial-grade FPGA.

Unique Advantages

• Balanced logic and memory  6,000 logic elements combined with 56,320 bits of RAM support a wide range of mid-complexity implementations without immediate need for external memory.
• High I/O capability  190 I/O pins let designers consolidate multiple interfaces around a single programmable device, reducing component count.
• Compact, high‑pin package  The 256-FPBGA (17×17 mm) package delivers a high pin density for space-constrained PCBs while remaining surface-mount compatible.
• Low-voltage operation  Narrow supply range (1.14–1.26 V) enables integration into low-voltage digital domains and consistent power budgeting.
• Commercial temperature qualification  Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS compliant  Meets RoHS requirements to support environmentally compliant product assemblies.

Why Choose LFE2-6E-6FN256C?

The LFE2-6E-6FN256C positions itself as a compact, commercially graded FPGA that balances logic capacity, embedded RAM and a high I/O count in a 256-BGA package. It is suitable for designers and procurement teams seeking a programmable device for commercial embedded systems where footprint, I/O density and low-voltage operation matter.

For projects requiring mid-range logic resources and on-chip memory with a dense pinout, this ECP2 FPGA offers a clear integration path that simplifies board-level design while maintaining standard commercial temperature and RoHS compliance.

If you would like pricing, availability or a quote for the LFE2-6E-6FN256C, submit a request for a quote or pricing inquiry to receive current lead-time and order information.