LFE2-6E-6FN256I

The LFE2-6E-6FN256I is a field programmable gate array (FPGA) supplied in a 256-BGA package. It provides a mid-range logic capacity with 6,000 logic elements and on-chip memory suitable for implementing custom digital logic and control functions.

Designed for surface-mount applications, this industrial-grade device supports operation from a 1.14 V to 1.26 V supply and a temperature range of −40 °C to 100 °C, while exposing 190 I/O pins for system integration.

Key Features

• Core Logic  6,000 logic elements for implementing custom digital logic, control paths and state machines.
• Embedded Memory  56,320 bits (approximately 0.056 Mbits) of on-chip RAM to support local buffering, FIFOs and small data tables.
• I/O Capacity  190 programmable I/O pins to interface with peripherals, sensors and external devices.
• Power  Operates from a 1.14 V to 1.26 V supply for predictable supply-domain design.
• Package & Mounting  256-BGA package; supplier device package 256-FPBGA (17×17). Surface-mount mounting type suitable for compact PCB layouts.
• Temperature & Grade  Industrial grade device rated for −40 °C to 100 °C operation.
• Environmental Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial control  Industrial-grade operation and wide temperature range enable deployment in factory automation, motor control logic and process-control interfaces.
• I/O-intensive systems  The 190 I/O pins support sensor aggregation, parallel interfaces and multi-peripheral connectivity without extensive external glue logic.
• Embedded logic and custom processing  6,000 logic elements and on-chip RAM allow implementation of custom pipelines, state machines and protocol handlers for embedded systems.
• OEM integration and compact systems  The 256-FPBGA (17×17) package and surface-mount mounting enable high-density board designs for OEM products.

Unique Advantages

• Balanced logic and memory mix: 6,000 logic elements combined with approximately 0.056 Mbits of embedded RAM supports a range of mid-sized logic implementations without external memory for small buffers.
• High I/O count: 190 I/Os simplify system-level connectivity and reduce the need for additional I/O expanders.
• Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact BGA footprint: 256-FPBGA (17×17) package provides a high-pin-count solution in a compact surface-mount form factor.
• Tight supply range: Operation between 1.14 V and 1.26 V supports consistent power-domain design and predictable voltage planning.
• RoHS compliant: Meets RoHS requirements for environmentally conscious designs.

Why Choose LFE2-6E-6FN256I?

The LFE2-6E-6FN256I offers a practical combination of logic capacity, on-chip memory and a high I/O count in a compact industrial-grade BGA package. Its supply and temperature ratings make it suitable for embedded designs that require robust operation across a wide thermal range.

This FPGA is well suited for designers and OEMs seeking a mid-range programmable logic device for industrial control, I/O aggregation and embedded custom logic, delivering integration and predictable system-level behavior within a compact footprint.

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