LFE2-6E-6T144C

The LFE2-6E-6T144C is an ECP2-series Field Programmable Gate Array (FPGA) in a 144-pin LQFP package, offering a compact, surface-mount programmable logic solution. It combines approximately 6,000 logic elements, on-chip embedded memory, and 90 I/Os to support mid-density integration for communications, protocol bridging, and signal-processing applications.

Designed for commercial-grade systems, the device operates from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C operating range, and is RoHS compliant. The underlying Lattice ECP2 family provides platform features such as sysDSP blocks, flexible memory resources, programmable I/O standards and clock management building blocks for practical system integration.

Key Features

• Logic Capacity — Approximately 6,000 logic elements (logic cells) to implement mid-density designs and glue-logic consolidation.
• Embedded Memory — Total on-chip RAM: 56,320 bits (approximately 56 Kbits) to support FIFOs, small buffers and distributed RAM requirements.
• I/O Count and Packaging — 90 I/Os available in a 144-LQFP surface-mount package; supplier package listed as 144-TQFP (20 × 20 mm).
• DSP and Math Acceleration — ECP2 family devices at this density include sysDSP blocks (ECP2-6 provides 3 sysDSP blocks) for multiply–accumulate and signal-processing functions.
• Clocking and Timing — On-chip clock management including general-purpose PLLs and DLLs (ECP2-6 family example: 2 GPLLs and 2 DLLs) for flexible clock generation and phase adjustment.
• Programmable sysI/O™ Buffer — Supports a wide range of interface standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL and others) enabling compatibility with diverse I/O signalling.
• Source-Synchronous I/O Support — Pre-engineered source-synchronous I/O with DDR register support and dedicated gearing logic for memory and high-speed ADC/DAC interfacing.
• Power and Mounting — Low-voltage core operation (1.14 V to 1.26 V) and surface-mount package suited to modern PCB assembly flows; RoHS compliant.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial-class electronics.

Typical Applications

• Communications & Networking — Implement protocol bridging, packet handling or PHY interface logic using the device’s programmable I/O and on-chip memory.
• High-Speed Serial Interfaces — Leverage ECP2 family SERDES and source-synchronous I/O support for designs requiring robust chip-to-chip or small backplane links (series-level capabilities).
• Signal Processing and DSP — Use the on-chip sysDSP resources for multiply–accumulate and real-time signal-processing tasks in embedded systems.
• Memory and Interface Controllers — Implement DDR/DDR2 interface logic, DQS-supporting memory controllers, and buffering using embedded RAM and I/O gearing.

Unique Advantages

• Balanced Integration: Combines ~6,000 logic elements with on-chip memory and DSP blocks to reduce external components and simplify BOM.
• Flexible I/O Standards: Programmable sysI/O supports multiple signaling families, enabling reuse across different interface requirements and markets.
• Compact Package: 144-pin LQFP (20 × 20 mm supplier TQFP variant) provides a small-footprint, surface-mount option for space-constrained PCBs.
• Power-Efficient Core: Narrow core voltage range (1.14 V–1.26 V) helps manage power budgets in battery-operated and low-power systems.
• Series-Level Tooling and Support: The Lattice ECP2 family is supported by established design flows and device-level features such as PLLs/DLLs and sysDSP blocks to accelerate development.
• Regulatory Compliance: RoHS-compliant material set simplifies environmental compliance for finished products.

Why Choose LFE2-6E-6T144C?

The LFE2-6E-6T144C positions itself as a practical mid-density FPGA choice for designers who need a balanced combination of logic, embedded memory and configurable I/O in a compact surface-mount package. Its commercial temperature rating, RoHS compliance and support for the ECP2 family’s DSP and clocking features make it well suited to communications, interface bridging and embedded signal-processing tasks.

For projects that require scalable FPGA functionality without excessive board area or power demands, this device offers an integration point that reduces external glue logic and speeds time to prototype while leveraging established family-level design features and tools.

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