LFE2-6E-7F256C

The LFE2-6E-7F256C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation’s ECP2 family. It provides a compact, surface-mount FPGA implementation in a 256-ball FPBGA package suitable for commercial electronic designs.

With 6,000 logic elements, approximately 56 kbits of on-chip RAM, and 190 user I/O, this device targets designers who need moderate programmable logic density, embedded memory, and generous I/O in a small footprint while operating at low core voltages.

Key Features

• Core Logic  6,000 logic elements provide programmable fabric for custom digital logic and control functions.
• Embedded Memory  Approximately 56 kbits (56,320 bits) of on-chip RAM for buffering, small FIFOs, and register storage.
• I/O Resources  190 user I/O pins support extensive external interfacing requirements in compact designs.
• Power  Rated core supply range from 1.14 V to 1.26 V to support low-voltage system designs.
• Package & Mounting  256-ball FPBGA package (256-FPBGA, 17 × 17 mm) with surface-mount mounting for high-density PCB integration.
• Operating Range  Commercial temperature grade with operating range from 0 °C to 85 °C for standard consumer and commercial applications.
• Environmental Compliance  RoHS-compliant design supporting regulatory requirements for hazardous-substance reduction.

Typical Applications

• I/O-Intensive Control  Use the device’s 190 I/O pins to implement custom interface logic, sensor aggregation, and control signal routing in compact systems.
• Embedded Data Buffering  Leverage approximately 56 kbits of on-chip RAM for small buffering and FIFO requirements in data-handling paths.
• Custom Logic and Glue  Deploy the 6,000 logic elements to implement application-specific state machines, protocol bridging, and glue logic between ICs.

Unique Advantages

• Balanced Logic and Memory:  6,000 logic elements paired with approximately 56 kbits of RAM offers a practical balance for mid-density programmable designs.
• High I/O Count in a Small Package:  190 user I/O pins in a 17 × 17 mm 256-FPBGA enable dense external connectivity without a large PCB footprint.
• Low-Voltage Operation:  Core supply range of 1.14 V to 1.26 V supports integration into modern low-voltage systems.
• Surface-Mount Integration:  256-ball FPBGA surface-mount packaging eases automated assembly and supports compact board layouts.
• Commercial Temperature Suitability:  Specified 0 °C to 85 °C operating range aligns with consumer and general commercial product requirements.
• RoHS Compliant:  Meets RoHS requirements for reduced hazardous substances in manufacturing.

Why Choose LFE2-6E-7F256C?

The LFE2-6E-7F256C delivers a practical combination of programmable logic density, embedded memory, and a high I/O count in a compact 256-FPBGA package. Its low-voltage core and commercial temperature rating make it well-suited for a variety of consumer and commercial applications requiring moderate FPGA resources.

This device is a fit for designers who need reliable, mid-range programmable logic with on-chip RAM and extensive I/O, packaged for space-constrained PCBs. Backed by Lattice Semiconductor Corporation’s ECP2 family architecture, it provides a stable platform for scalable and maintainable designs.

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