LFE2-6E-7TN144C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 90 56320 6000 144-LQFP |
|---|---|
| Quantity | 601 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 90 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 750 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFE2-6E-7TN144C – ECP2 Field Programmable Gate Array (FPGA) IC, 90 I/O, 6000 Logic Elements, 144-LQFP
The LFE2-6E-7TN144C is an ECP2 family Field Programmable Gate Array (FPGA) IC designed for commercial electronic applications. It provides a balanced combination of programmable logic, embedded memory, and I/O capability in a surface-mount 144-pin package.
With approximately 6,000 logic elements, 90 available I/O pins and about 56,320 bits of on-chip RAM, this device targets commercial embedded designs that require moderate logic density and flexible interfacing options while operating within a 0 °C to 85 °C range.
Key Features
- Core / Logic Approximately 6,000 logic elements for implementing custom digital logic, state machines and glue logic in commercial designs.
- Embedded Memory Approximately 56,320 bits of on-chip RAM (approximately 0.056 Mbits) to support small data buffers, FIFOs and localized storage.
- I/O 90 input/output pins to support multiple peripheral interfaces, parallel buses and general-purpose signals.
- Power Low-voltage operation with a supply range of 1.14 V to 1.26 V for core power planning and system-level power budgeting.
- Package & Mounting Available in a 144-LQFP package (supplier device package listed as 144-TQFP, 20×20) with surface-mount mounting for PCB assembly.
- Operating Range & Compliance Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and manufacturing requirements.
Typical Applications
- Commercial Embedded Systems — Use the FPGA’s logic capacity and 90 I/O pins to implement custom control, timing and interface functions within commercial electronic products.
- Interface Bridging & Glue Logic — Implement protocol conversion, bus interfacing and peripheral aggregation using the device’s available logic and I/O resources.
- Prototyping and Development — Leverage the ECP2 FPGA’s programmable fabric for prototyping digital functions and validating system-level designs in commercial environments.
Unique Advantages
- Balanced Logic Density: Approximately 6,000 logic elements provide a mid-range capacity suitable for many commercial design requirements without excessive footprint or cost.
- Sufficient Embedded Memory: Around 56,320 bits of on-chip RAM support local buffering and small data structures, reducing external memory dependencies.
- Generous I/O Count: Ninety I/O pins enable versatile peripheral connectivity and multiple interface implementations on a single device.
- Compact Surface-Mount Package: 144-LQFP (supplier 144-TQFP, 20×20) allows for space-efficient PCB layouts while providing a high pin count.
- Predictable Commercial Operating Range: Rated for 0 °C to 85 °C, making thermal and environmental planning straightforward for commercial products.
- RoHS Compliant: Conforms to RoHS requirements to simplify supply-chain and regulatory compliance for mass production.
Why Choose LFE2-6E-7TN144C?
The LFE2-6E-7TN144C positions itself as a practical, commercial-grade FPGA option for designers who need a balance of programmable logic, embedded memory and I/O capacity in a compact surface-mount package. Its approximately 6,000 logic elements and 90 I/O pins make it suitable for a wide range of mid-complexity digital tasks.
For teams building commercial embedded products that require predictable operating conditions, RoHS compliance and a moderate level of on-chip resources, this ECP2 FPGA offers a focused combination of features to streamline design integration and BOM planning.
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