LFE2-6SE-5FN256I

The LFE2-6SE-5FN256I is an industrial-grade FPGA from the Lattice ECP2 family, supplied in a compact 256-ball fpBGA (17 × 17 mm) package for surface-mount assembly. It combines a low-voltage core, flexible I/O count and on-chip memory to deliver a programmable logic platform suited for space-constrained, temperature-demanding embedded designs.

Designed for system integration, this device provides approximately 6,000 logic elements, around 56,320 bits of embedded memory and up to 190 I/Os while operating from a 1.14 V to 1.26 V supply and across an industrial temperature range of −40 °C to 100 °C.

Key Features

• Core Logic — Approximately 6,000 logic elements provide the programmable fabric required for glue logic, control functions and medium-complexity FPGA tasks.
• Memory — Approximately 56,320 bits of on-chip RAM (embedded block RAM) for buffering, small FIFOs and local data storage.
• I/O Capacity — Up to 190 general-purpose I/Os to support wide parallel interfaces, sensor arrays and multi-channel signal routing.
• Clocking and DSP Support — Family-level features include integrated PLLs and DLLs plus dedicated DSP block support as described in the Lattice ECP2 family data sheet for system timing and arithmetic acceleration.
• Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V suitable for power-sensitive applications.
• Package and Mounting — 256-ball fpBGA (17 × 17 mm) supplier device package, surface-mountable for compact board designs.
• Industrial Temperature Grade — Specified operating range of −40 °C to 100 °C for deployment in industrial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Use the device for control logic, motor control interface glue logic and distributed I/O in industrial automation systems where extended temperature range is required.
• Embedded Processing and Glue Logic — Implement custom combinational and sequential logic, protocol adaptation, and peripheral aggregation using the on-chip logic and memory resources.
• Data Acquisition and Signal Conditioning — Support multi-channel sensor inputs and local buffering with abundant I/O and embedded RAM for real-time preprocessing.
• Communications Interfaces — Integrate parallel and serial interface bridging and timing functions using the device’s I/O density and clocking resources.

Unique Advantages

• Compact, high-density package: The 256-ball fpBGA (17 × 17 mm) package enables a small PCB footprint while providing up to 190 I/Os for complex interfacing.
• Low-voltage operation: 1.14 V to 1.26 V core supply reduces system power draw and simplifies power-rail planning for modern embedded systems.
• Industrial temperature range: Rated from −40 °C to 100 °C so designs can be deployed in harsher environments without additional thermal derating.
• Balanced logic and memory: Approximately 6,000 logic elements paired with ~56 Kbits of embedded RAM support mid-range FPGA tasks without requiring external memory for small buffers.
• RoHS compliant: Meets common lead-free manufacturing requirements for environmental compliance.

Why Choose LFE2-6SE-5FN256I?

The LFE2-6SE-5FN256I provides a balanced combination of programmable logic density, embedded memory and a high I/O count in a compact, surface-mount fpBGA package. Its industrial temperature rating and low-voltage core make it a practical choice for embedded, industrial and communications-oriented designs that require dependable operation over a wide temperature range.

This part is suited to engineers and procurement teams designing mid-complexity FPGA-based subsystems where board space, I/O flexibility and on-chip memory are primary considerations. Leveraging the ECP2 family capabilities described in the manufacturer data, this device offers a practical platform for accelerating designs while maintaining manufacturability and regulatory compliance.

Request a quote or submit a procurement inquiry for LFE2-6SE-5FN256I to check pricing and availability for your next design.