LFE2-6SE-5F256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA |
|---|---|
| Quantity | 224 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 190 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 750 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFE2-6SE-5F256C – ECP2 Field Programmable Gate Array (FPGA) IC
The LFE2-6SE-5F256C is an ECP2 family Field Programmable Gate Array supplied in a 256-BGA package. It provides a balance of programmable logic capacity, on-chip memory and a high I/O count for compact, board-level digital designs.
With 6,000 logic elements, 190 I/O pins and approximately 0.056 Mbits of embedded RAM, this commercial-grade device is suited to designs that require moderate logic density, substantial I/O connectivity and low-voltage operation.
Key Features
- Core Logic 6,000 logic elements for implementing configurable digital logic and custom data paths.
- Embedded Memory 56,320 bits of on-chip RAM (approximately 0.056 Mbits) to support data buffering and small on-chip storage.
- I/O 190 user I/O pins to support multiple interfaces and parallel connections at the board level.
- Power Operates from a low-voltage supply range of 1.14 V to 1.26 V, enabling integration into modern low-voltage systems.
- Package & Mounting 256-ball BGA (256-FPBGA, 17 × 17) package optimized for surface-mount assembly and compact PCB layouts.
- Temperature & Grade Commercial operating temperature range of 0 °C to 85 °C, suitable for standard consumer and business electronics.
- Environmental Compliance RoHS-compliant construction for environmental and supply-chain compatibility.
Typical Applications
- High-density I/O Interfaces Use the 190 I/O pins to implement multi-channel digital interfaces, protocol bridging or parallel peripheral connections.
- Embedded Logic and Control Deploy the 6,000 logic elements for custom control logic, state machines and moderate-complexity signal processing.
- On-board Data Buffering Leverage the on-chip RAM for small data queues, packet buffering or temporary storage in mixed-signal systems.
Unique Advantages
- Compact, high-density package: The 256-FPBGA (17 × 17) footprint provides a small board area for designs with tight PCB real estate.
- Balanced logic and memory: 6,000 logic elements paired with embedded RAM supports flexible implementation of control and data-path functions without external memory for small buffers.
- Extensive I/O capability: 190 I/O pins enable direct connectivity to multiple peripherals and parallel interfaces, reducing the need for external interface components.
- Low-voltage operation: 1.14–1.26 V supply range aligns with low-voltage system domains and helps simplify power-rail planning.
- RoHS compliance: Meets common environmental requirements for modern electronics manufacturing.
- Surface-mount readiness: Delivered in a standard BGA package for automated assembly and reliable solder mounting.
Why Choose LFE2-6SE-5F256C?
The LFE2-6SE-5F256C combines a practical logic capacity with a high I/O count and on-chip RAM in a compact 256-BGA package, making it well suited for medium-complexity programmable logic tasks in commercial electronic designs. Its low-voltage supply range and RoHS-compliant construction help simplify system integration and manufacturing considerations.
This FPGA is a fit for designers who need a configurable logic device offering moderate density, substantial connectivity and compact packaging for consumer and business electronics operating within a commercial temperature range.
If you would like pricing or availability, request a quote or submit a pricing inquiry and our team will respond with details to support your design and procurement needs.

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