LFE2-6SE-5F256I

The LFE2-6SE-5F256I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial-grade applications. It integrates 6,000 logic elements with on-chip embedded memory and offers a large I/O count in a compact 256-BGA package, providing a balance of integration and configurability for board- and system-level designs.

With a supply voltage range of 1.14–1.26 V and an operating temperature range of −40 °C to 100 °C, this device is specified for environments that require extended temperature operation while maintaining RoHS compliance and surface-mount assembly compatibility.

Key Features

• Logic Capacity  Contains 6,000 logic elements for implementing custom digital functions, supported by 750 CLBs for organized logic grouping.
• Embedded Memory  Provides a total of 56,320 bits of on-chip RAM (approximately 0.056 Mbits) for data buffering, small FIFOs, and temporary storage.
• I/O Resources  190 device I/Os enable rich interfacing options for multiple peripheral connections and parallel interfaces.
• Power Supply  Operates from a supply voltage range of 1.14–1.26 V to match target system power rails.
• Package and Mounting  Available in a 256-BGA package (supplier device package: 256-FPBGA 17×17) and intended for surface-mount assembly.
• Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Regulatory Compliance  RoHS compliant for lead-free manufacturing and environmental requirements.

Typical Applications

• Industrial Control  Suitable for industrial control systems that require an industrial temperature range and flexible I/O routing to manage sensors, actuators, and communication interfaces.
• Interface Bridging  High I/O count enables protocol conversion and peripheral aggregation, connecting multiple interfaces on a single programmable device.
• Embedded Logic and Glue  Use as a customizable logic engine to implement glue logic, timing adjustments, and small-scale hardware accelerators within constrained board spaces.

Unique Advantages

• Balanced Logic and Memory:  6,000 logic elements paired with approximately 0.056 Mbits of embedded RAM permit compact implementations of control and data-path functions without external memory.
• High I/O Integration:  190 I/Os reduce the need for external multiplexing or bus extenders, simplifying board-level design and lowering BOM complexity.
• Industrial Reliability:  Specified operation from −40 °C to 100 °C supports deployments in harsher thermal environments.
• Compact BGA Packaging:  256-BGA (256-FPBGA 17×17) enables a small PCB footprint while delivering substantial functionality for space-constrained designs.
• RoHS Compliance:  Meets lead-free manufacturing requirements for environmentally conscious production processes.

Why Choose LFE2-6SE-5F256I?

The LFE2-6SE-5F256I delivers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 256-BGA package targeted at industrial applications. Its specified supply voltage range and wide operating temperature window make it suitable for designers seeking a programmable solution that integrates reasonably complex logic functions while addressing environmental and manufacturing requirements.

This device is ideal for engineers building industrial control systems, interface bridging solutions, and embedded logic functions where a balance of integration, I/O density, and temperature tolerance provides long-term value and design flexibility.

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