LFE2-6E-7FN256C

The LFE2-6E-7FN256C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, provided in a 256-ball BGA package. It delivers a mid-range programmable logic fabric with a balance of logic capacity, on-chip memory, and a high pin count for I/O-intensive designs.

Designed for commercial-grade embedded applications, this device targets designs that require roughly 6,000 logic elements, extensive I/O connectivity, and a compact FPBGA footprint while operating at a low core voltage range.

Key Features

• Core Logic  Approximately 6,000 logic elements organized across 750 logic blocks to implement combinational and sequential logic functions.
• Embedded Memory  Approximately 0.056 Mbits of embedded memory (56,320 bits) for on-chip data buffering and small lookup tables.
• I/O Capacity  190 general-purpose I/Os to support parallel interfaces, multiple peripherals, and board-level integration without excessive external glue logic.
• Package  256-ball BGA in a 256-FPBGA (17 × 17 mm) footprint for a compact board profile and high pin density.
• Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V for designs targeting reduced core power consumption.
• Mounting & Grade  Surface-mount package supplied in a commercial grade configuration with an operating temperature range of 0 °C to 85 °C.
• Environmental  RoHS-compliant to meet common environmental regulations for electronic assemblies.

Typical Applications

• Embedded Control and Glue Logic  Use the device’s ~6,000 logic elements and 190 I/Os to implement board-level control, protocol bridging, and peripheral aggregation without many discrete components.
• Interface and Connectivity  High I/O count enables parallel buses and multiple interface endpoints for communications and instrumentation designs.
• Prototyping and Small FPGA Designs  Compact 256-BGA package and modest logic/memory resources make it suitable for mid-range prototypes and space-constrained designs.

Unique Advantages

• Balanced Logic and I/O  The combination of approximately 6,000 logic elements and 190 I/Os supports designs that need moderate programmable logic with significant external connectivity.
• Compact, High-Density Package  256-FPBGA (17 × 17) provides a high pin count in a small footprint for dense board layouts.
• Low-Voltage Operation  Core voltage range of 1.14 V to 1.26 V helps designers meet low-power core budgets where applicable.
• On-Board Memory for Local Storage  Approximately 0.056 Mbits of embedded RAM allows local buffering and LUT storage without external memory for small datasets and state machines.
• Commercial-Grade Availability  Rated for 0 °C to 85 °C operation to suit standard commercial embedded products and designs.
• Regulatory Compliance  RoHS-compliant to align with environmental and assembly requirements.

Why Choose LFE2-6E-7FN256C?

The LFE2-6E-7FN256C positions itself as a mid-range ECP2 FPGA choice for designers who need a practical balance of programmable logic, embedded memory, and a high I/O count in a compact BGA package. Its low-voltage core and surface-mount 256-FPBGA footprint make it suitable for space-conscious commercial applications that require substantial I/O routing and moderate on-chip logic resources.

Choose this device when your design requires integrated programmable logic with strong I/O capabilities, modest embedded memory, and compliance with common environmental standards—backed by support from the device manufacturer.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the LFE2-6E-7FN256C. Our team can provide the details needed to move your design forward.