LFE2-6E-6TN144C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 90 56320 6000 144-LQFP |
|---|---|
| Quantity | 1,941 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 90 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 750 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFE2-6E-6TN144C – ECP2 Field Programmable Gate Array (FPGA) IC
The LFE2-6E-6TN144C is an ECP2 family Field Programmable Gate Array (FPGA) in a 144-pin LQFP package. It combines 6,000 logic elements, approximately 56,320 bits of on-chip RAM, and up to 90 I/O to address commercial embedded designs that require moderate logic density and memory integration.
Designed for surface-mount placement and RoHS-compliant manufacturing, this commercial-grade device operates from 1.14 V to 1.26 V and across a 0 °C to 85 °C temperature range.
Key Features
- Core Logic 6,000 logic elements provide the configurable logic capacity for custom combinational and sequential logic implementations.
- Embedded Memory Approximately 56,320 bits of on-chip RAM support buffering, small lookup tables, and state storage without external memory.
- I/O Count Up to 90 I/O pins enable connections to peripherals, buses, and external devices for flexible system integration.
- Power Low-voltage operation with a supply range of 1.14 V to 1.26 V suitable for power-sensitive designs.
- Package & Mounting 144-LQFP package (supplier device package listed as 144-TQFP, 20×20) in a surface-mount form factor for compact PCB layouts.
- Temperature & Grade Commercial-grade device specified for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant to support regulated manufacturing and assembly processes.
Typical Applications
- Commercial Embedded Systems Use where moderate logic density and on-chip RAM are needed to implement custom control or data-path functions within commercial temperature limits.
- Prototyping and Custom Logic Implement and iterate custom logic functions that leverage 6,000 logic elements and embedded RAM for evaluation and early product development.
- I/O-Intensive Interfaces Provide connectivity for systems that require up to 90 external signals, enabling glue logic, interface translation, or protocol handling.
- Low-Voltage Designs Integrate into designs that target a 1.14 V–1.26 V supply domain to meet power and platform constraints.
Unique Advantages
- Balanced Logic and Memory: 6,000 logic elements paired with approximately 56,320 bits of on-chip RAM reduce reliance on external memory for many control and buffering tasks.
- Generous I/O Count: Up to 90 I/Os simplify board-level routing for multi-device interfaces and peripheral connections.
- Compact Surface-Mount Package: 144-LQFP / 144-TQFP (20×20) footprint enables high-density PCB designs while keeping assembly straightforward.
- Low-Voltage Operation: 1.14 V to 1.26 V supply range supports power-constrained designs and modern supply architectures.
- Commercial Grade with RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance align with standard commercial product requirements and manufacturing workflows.
Why Choose LFE2-6E-6TN144C?
The LFE2-6E-6TN144C positions itself as a practical, commercial-grade FPGA option where a balance of logic density, on-chip memory, and I/O flexibility is required. Its combination of 6,000 logic elements, roughly 56,320 bits of embedded RAM, and up to 90 I/O in a compact surface-mount package makes it suitable for designers consolidating discrete logic and modest buffering within a controlled temperature range.
This device delivers a straightforward integration path for teams developing commercial embedded solutions that require configurable logic, predictable power characteristics, and RoHS-compliant manufacturing. It is appropriate for projects where on-chip resources and a compact package help reduce BOM complexity and simplify PCB layout.
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Headquarters: Hillsboro, Oregon, USA
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