LFE2-6E-6TN144C

IC FPGA 90 I/O 144TQFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 90 56320 6000 144-LQFP

Quantity 1,941 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O90Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs750Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFE2-6E-6TN144C – ECP2 Field Programmable Gate Array (FPGA) IC

The LFE2-6E-6TN144C is an ECP2 family Field Programmable Gate Array (FPGA) in a 144-pin LQFP package. It combines 6,000 logic elements, approximately 56,320 bits of on-chip RAM, and up to 90 I/O to address commercial embedded designs that require moderate logic density and memory integration.

Designed for surface-mount placement and RoHS-compliant manufacturing, this commercial-grade device operates from 1.14 V to 1.26 V and across a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic  6,000 logic elements provide the configurable logic capacity for custom combinational and sequential logic implementations.
  • Embedded Memory  Approximately 56,320 bits of on-chip RAM support buffering, small lookup tables, and state storage without external memory.
  • I/O Count  Up to 90 I/O pins enable connections to peripherals, buses, and external devices for flexible system integration.
  • Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V suitable for power-sensitive designs.
  • Package & Mounting  144-LQFP package (supplier device package listed as 144-TQFP, 20×20) in a surface-mount form factor for compact PCB layouts.
  • Temperature & Grade  Commercial-grade device specified for operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant to support regulated manufacturing and assembly processes.

Typical Applications

  • Commercial Embedded Systems  Use where moderate logic density and on-chip RAM are needed to implement custom control or data-path functions within commercial temperature limits.
  • Prototyping and Custom Logic  Implement and iterate custom logic functions that leverage 6,000 logic elements and embedded RAM for evaluation and early product development.
  • I/O-Intensive Interfaces  Provide connectivity for systems that require up to 90 external signals, enabling glue logic, interface translation, or protocol handling.
  • Low-Voltage Designs  Integrate into designs that target a 1.14 V–1.26 V supply domain to meet power and platform constraints.

Unique Advantages

  • Balanced Logic and Memory:  6,000 logic elements paired with approximately 56,320 bits of on-chip RAM reduce reliance on external memory for many control and buffering tasks.
  • Generous I/O Count:  Up to 90 I/Os simplify board-level routing for multi-device interfaces and peripheral connections.
  • Compact Surface-Mount Package:  144-LQFP / 144-TQFP (20×20) footprint enables high-density PCB designs while keeping assembly straightforward.
  • Low-Voltage Operation:  1.14 V to 1.26 V supply range supports power-constrained designs and modern supply architectures.
  • Commercial Grade with RoHS Compliance:  Specified 0 °C to 85 °C operation and RoHS compliance align with standard commercial product requirements and manufacturing workflows.

Why Choose LFE2-6E-6TN144C?

The LFE2-6E-6TN144C positions itself as a practical, commercial-grade FPGA option where a balance of logic density, on-chip memory, and I/O flexibility is required. Its combination of 6,000 logic elements, roughly 56,320 bits of embedded RAM, and up to 90 I/O in a compact surface-mount package makes it suitable for designers consolidating discrete logic and modest buffering within a controlled temperature range.

This device delivers a straightforward integration path for teams developing commercial embedded solutions that require configurable logic, predictable power characteristics, and RoHS-compliant manufacturing. It is appropriate for projects where on-chip resources and a compact package help reduce BOM complexity and simplify PCB layout.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-6E-6TN144C.

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